Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9461106 | MIM capacitor and method forming the same | Ching-Jung Yang, Hsien-Ming Tu, Hao-Yi Tsai, Mirng-Ji Lii, Shih-Wei Liang +1 more | 2016-10-04 |
| 9343417 | Hollow metal pillar packaging scheme | Hsien-Ming Tu, Hsien-Wei Chen, Tung-Liang Shao, Ching-Jung Yang, Yu-Chia Lai | 2016-05-17 |
| 9318456 | Self-alignment structure for wafer level chip scale package | Yu-Chia Lai, Hsien-Ming Tu, Tung-Liang Shao, Hsien-Wei Chen, Ching-Jung Yang | 2016-04-19 |
| 9048149 | Self-alignment structure for wafer level chip scale package | Yu-Chia Lai, Hsien-Ming Tu, Tung-Liang Shao, Hsien-Wei Chen, Ching-Jung Yang | 2015-06-02 |
| 8963328 | Reducing delamination between an underfill and a buffer layer in a bond structure | Ching-Jung Yang, Tzuan-Horng Liu, Michael Shou-Ming Tong, Ying-Ju Chen, Tung-Liang Shao +3 more | 2015-02-24 |
| 8610267 | Reducing delamination between an underfill and a buffer layer in a bond structure | Ching-Jung Yang, Tzuan-Horng Liu, Michael Shou-Ming Tong, Ying-Ju Chen, Tung-Liang Shao +3 more | 2013-12-17 |