Issued Patents All Time
Showing 51–75 of 76 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10062654 | Semicondcutor structure and semiconductor manufacturing process thereof | Chen-Hua Yu, Chang-Pin Huang, Chung-Shi Liu, Hsien-Ming Tu, Hung-Yi Kuo +3 more | 2018-08-28 |
| 10032737 | Semiconductor device and manufacturing method thereof | Tung-Liang Shao, Hsien-Ming Tu, Chang-Pin Huang, Ching-Jung Yang | 2018-07-24 |
| 9947630 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Wei Chen, Hsien-Ming Tu, Chang-Pin Huang, Tung-Liang Shao | 2018-04-17 |
| 9852985 | Conductive terminal on integrated circuit | Chen-Hua Yu, Chang-Pin Huang, Chung-Shi Liu, Hsien-Ming Tu, Hung-Yi Kuo +3 more | 2017-12-26 |
| 9812434 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Tung-Liang Shao, Ching-Jung Yang | 2017-11-07 |
| 9799615 | Package structures having height-adjusted molding members and methods of forming the same | Chang-Pin Huang, Chung-Shi Liu, Hsien-Ming Tu, Hung-Yi Kuo, Hao-Yi Tsai +2 more | 2017-10-24 |
| 9786618 | Semiconductor structure and manufacturing method thereof | Chang-Pin Huang, Hsien-Ming Tu, Ching-Jung Yang, Shih-Wei Liang, Hung-Yi Kuo +3 more | 2017-10-10 |
| 9748212 | Shadow pad for post-passivation interconnect structures | Shih-Wei Liang, Bor-Rung Su, Chang-Pin Huang, Chien-Chia Chiu, Hsien-Ming Tu +1 more | 2017-08-29 |
| 9679883 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Tung-Liang Shao, Ching-Jung Yang | 2017-06-13 |
| 9673270 | Metal insulator metal capacitor and method for making the same | Tung-Liang Shao, Ching-Jung Yang | 2017-06-06 |
| 9640498 | Integrated fan-out (InFO) package structures and methods of forming same | Chang-Pin Huang, Chen-Hua Yu, Ching-Jung Yang, Chung-Shi Liu, Hsien-Ming Tu +3 more | 2017-05-02 |
| 9627332 | Integrated circuit structure and seal ring structure | Shih-Wei Liang, Hsien-Ming Tu, Ching-Jung Yang, Chang-Pin Huang | 2017-04-18 |
| 9559044 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Wei Chen, Hsien-Ming Tu, Chang-Pin Huang, Tung-Liang Shao | 2017-01-31 |
| 9484318 | Semiconductor device and manufacturing method thereof | Tung-Liang Shao, Hsien-Ming Tu, Chang-Pin Huang, Ching-Jung Yang | 2016-11-01 |
| 9461106 | MIM capacitor and method forming the same | Ching-Jung Yang, Chang-Pin Huang, Hsien-Ming Tu, Hao-Yi Tsai, Mirng-Ji Lii +1 more | 2016-10-04 |
| 9449927 | Seal ring structure with metal-insulator-metal capacitor | Hsien-Wei Chen, Tung-Liang Shao, Ching-Jung Yang, Hao-Yi Tsai, Tsung-Yuan Yu | 2016-09-20 |
| 9343417 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Tung-Liang Shao, Ching-Jung Yang | 2016-05-17 |
| 9318456 | Self-alignment structure for wafer level chip scale package | Hsien-Ming Tu, Tung-Liang Shao, Hsien-Wei Chen, Chang-Pin Huang, Ching-Jung Yang | 2016-04-19 |
| 9153504 | Metal insulator metal capacitor and method for making the same | Tung-Liang Shao, Ching-Jung Yang | 2015-10-06 |
| 9048149 | Self-alignment structure for wafer level chip scale package | Hsien-Ming Tu, Tung-Liang Shao, Hsien-Wei Chen, Chang-Pin Huang, Ching-Jung Yang | 2015-06-02 |
| 8587940 | Server with fan module | — | 2013-11-19 |
| 8422227 | Electronic device and heat dissipation device thereof | — | 2013-04-16 |
| 8405987 | Cooling system for electronic device and electronic device having same | — | 2013-03-26 |
| 8363401 | Air guiding device and heat dissipation system having same | — | 2013-01-29 |
| 8228672 | Computer enclosure including air guide members | Meng-Hsien Lin, YAO-TING CHANG | 2012-07-24 |