Issued Patents All Time
Showing 26–50 of 76 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502013 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee +3 more | 2022-11-15 |
| 11495590 | Multi-chip semiconductor package | Kuo Lung Pan, Hung-Yi Kuo, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2022-11-08 |
| 11469200 | Semiconductor device and manufacturing method thereof | Tung-Liang Shao, Hsien-Ming Tu, Chang-Pin Huang, Ching-Jung Yang | 2022-10-11 |
| 11444002 | Package structure | Chen-Hua Yu, Chung-Shi Liu, Hsiao-Chung Liang, Hao-Yi Tsai, Chien Ling Hwang +4 more | 2022-09-13 |
| 11424213 | Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin +2 more | 2022-08-23 |
| 11322421 | Package structure and method of forming the same | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin +2 more | 2022-05-03 |
| 11282791 | Semiconductor device having a heat dissipation structure connected chip package | Po-Yuan Teng, Hung-Yi Kuo, Hao-Yi Tsai, Tin-Hao Kuo, Shih-Wei Chen | 2022-03-22 |
| 11183487 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai +2 more | 2021-11-23 |
| 11121052 | Integrated fan-out device, 3D-IC system, and method | Cheng-Chieh Hsieh, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2021-09-14 |
| 11107771 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Kuo Lung Pan, Hao-Yi Tsai +2 more | 2021-08-31 |
| 11088110 | Semiconductor device, circuit board structure and manufacturing method thereof | Tin-Hao Kuo, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Po-Yuan Teng | 2021-08-10 |
| 11088125 | IPD modules with flexible connection scheme in packaging | Cheng-Chieh Hsieh, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2021-08-10 |
| 11062975 | Package structures | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Kuo-Chung Yee, Tin-Hao Kuo | 2021-07-13 |
| 11004827 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo +3 more | 2021-05-11 |
| 11004758 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee +3 more | 2021-05-11 |
| 10985101 | Semiconductor package and manufacturing method thereof | Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Kuo-Chung Yee +1 more | 2021-04-20 |
| 10985121 | Bump structure and fabricating method thereof | Chang-Pin Huang, Tung-Liang Shao, Hsien-Ming Tu, Ching-Jung Yang | 2021-04-20 |
| 10879198 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Wei Chen, Hsien-Ming Tu, Chang-Pin Huang, Tung-Liang Shao | 2020-12-29 |
| 10854564 | Semiconductor device and manufacturing method thereof | Tung-Liang Shao, Hsien-Ming Tu, Chang-Pin Huang, Ching-Jung Yang | 2020-12-01 |
| 10847505 | Multi-chip semiconductor package | Kuo Lung Pan, Hung-Yi Kuo, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2020-11-24 |
| 10825804 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Tung-Liang Shao, Ching-Jung Yang | 2020-11-03 |
| 10354986 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Tung-Liang Shao, Ching-Jung Yang | 2019-07-16 |
| 10269737 | Method for manufacturing semiconductor structure | Chang-Pin Huang, Hsien-Ming Tu, Ching-Jung Yang, Shih-Wei Liang, Hung-Yi Kuo +3 more | 2019-04-23 |
| 10262958 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Wei Chen, Hsien-Ming Tu, Chang-Pin Huang, Tung-Liang Shao | 2019-04-16 |
| 10163828 | Semiconductor device and fabricating method thereof | Chang-Pin Huang, Tung-Liang Shao, Hsien-Ming Tu, Ching-Jung Yang | 2018-12-25 |