Issued Patents All Time
Showing 51–53 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7781878 | Zigzag-stacked package structure | Yu-Ren Chen | 2010-08-24 |
| 7642639 | COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same | Hsiang-Ming Huang, An-Hong Liu, Yi-Chang Lee | 2010-01-05 |
| 7554197 | High frequency IC package and method for fabricating the same | Hsiang-Ming Huang, An-Hong Liu, Yi-Chang Lee, Wu-Chang Tu, Chun-Hung Lin +1 more | 2009-06-30 |