Issued Patents All Time
Showing 26–50 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510712 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Hsiao-Chung Liang, Chung-Shi Liu | 2019-12-17 |
| 10504870 | Mechanisms for forming bonding structures | Hsin-Hung Liao, Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang, Chung-Shi Liu | 2019-12-10 |
| 10276531 | Semiconductor device having a boundary structure, a package on package structure, and a method of making | Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang | 2019-04-30 |
| 10157881 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Hsiao-Chung Liang, Chung-Shi Liu | 2018-12-18 |
| 10147693 | Methods for stud bump formation | Chien Ling Hwang, Yi-Li Hsiao, Ming-Da Cheng, Tsai-Tsung Tsai, Chung-Shi Liu +2 more | 2018-12-04 |
| 10056285 | Semiconductor wafer device and manufacturing method thereof | Bor-Ping Jang, Chien Ling Hwang, Hsin-Hung Liao | 2018-08-21 |
| 9929118 | Packaging through pre-formed metal pins | Chen-Hua Yu, Chien Ling Hwang | 2018-03-27 |
| 9917069 | Hybrid bonding system and cleaning method thereof | Ping-Yin Liu, Xin-Hua Huang, Chia-Shiung Tsai | 2018-03-13 |
| 9893044 | Wafer-level underfill and over-molding | Bor-Ping Jang, Chung-Shi Liu, Chien Ling Hwang | 2018-02-13 |
| 9834435 | Structure and formation method of semiconductor device structure | Ping-Yin Liu, Xin-Hua Huang, Jung-Huei Peng | 2017-12-05 |
| 9812346 | Semiconductor wafer device and manufacturing method thereof | Bor-Ping Jang, Chien Ling Hwang, Hsin-Hung Liao | 2017-11-07 |
| 9802349 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Chien Ling Hwang, Chung-Shi Liu, Meng-Tse Chen, Ming-Da Cheng +1 more | 2017-10-31 |
| 9768142 | Mechanisms for forming bonding structures | Hsin-Hung Liao, Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang, Chung-Shi Liu | 2017-09-19 |
| 9659891 | Semiconductor device having a boundary structure, a package on package structure, and a method of making | Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang | 2017-05-23 |
| 9583365 | Method of forming interconnects for three dimensional integrated circuit | Chun-Hui Yu, Kuo-Chung Yee, Chen-Hua Yu, Chia-Hsiang Lin, Liang-Ju Yen +1 more | 2017-02-28 |
| 9498851 | Methods for forming apparatus for stud bump formation | Hsin-Hung Liao, Chien Ling Hwang, Yi-Li Hsiao, Chung-Shi Liu, Mirng-Ji Lii +1 more | 2016-11-22 |
| 9484226 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Hsiao-Chung Liang, Chung-Shi Liu | 2016-11-01 |
| 9425179 | Chip packages and methods of manufacture thereof | Chien Ling Hwang, Pei-Hsuan Lee, Ying-Jui Huang, Chung-Shi Liu | 2016-08-23 |
| 9418953 | Packaging through pre-formed metal pins | Chen-Hua Yu, Chien Ling Hwang | 2016-08-16 |
| 9236351 | Semiconductor wafer device | Bor-Ping Jang, Chien Ling Hwang, Hsin-Hung Liao | 2016-01-12 |
| 9093337 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Hsiao-Chung Liang, Chung-Shi Liu | 2015-07-28 |
| 9021682 | Apparatus for stud bump formation | Chien Ling Hwang, Yi-Li Hsiao, Ming-Da Cheng, Tsai-Tsung Tsai, Chung-Shi Liu +2 more | 2015-05-05 |
| 8951037 | Wafer-level underfill and over-molding | Bor-Ping Jang, Chien Ling Hwang, Chung-Shi Liu | 2015-02-10 |
| 8936730 | Methods for forming apparatus for stud bump formation | Hsin-Hung Liao, Chien Ling Hwang, Chung-Shi Liu, Mirng-Ji Lii, Chen-Hua Yu +1 more | 2015-01-20 |
| 8540136 | Methods for stud bump formation and apparatus for performing the same | Hsin-Hung Liao, Chien Ling Hwang, Yi-Li Hsiao, Chung-Shi Liu, Mirng-Ji Lii +1 more | 2013-09-24 |