Issued Patents All Time
Showing 1–25 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293944 | Semiconductor device with self-aligned vias | Chien-Han Chen, Chien-Chih Chiu | 2025-05-06 |
| 11521857 | Cut first self-aligned litho-etch patterning | Kuan-Wei Huang, Chia-Ying Lee | 2022-12-06 |
| 11502001 | Semiconductor device with self-aligned vias | Chien-Han Chen, Chien-Chih Chiu | 2022-11-15 |
| 11251127 | Interconnect structure with vias extending through multiple dielectric layers | Chun-Te Ho, Chien-Chih Chiu, Chien-Han Chen | 2022-02-15 |
| 11037789 | Cut last self-aligned litho-etch patterning | Kuan-Wei Huang, Chia-Ying Lee | 2021-06-15 |
| 11018021 | Curing photo resist for improving etching selectivity | Wen-Kuo Hsieh, Tsung-Hung Chu | 2021-05-25 |
| 10553431 | Cut last self-aligned litho-etch patterning | Kuan-Wei Huang, Chia-Ying Lee | 2020-02-04 |
| 10522468 | Interconnect structure and method | Chun-Te Ho, Chien-Chih Chiu, Chien-Han Chen | 2019-12-31 |
| 10347505 | Curing photo resist for improving etching selectivity | Wen-Kuo Hsieh, Tsung-Hung Chu | 2019-07-09 |
| 10290535 | Integrated circuit fabrication with a passivation agent | Chun-Te Ho, Shih-Yu Chang, Da-Wei Lin, Chien-Chih Chiu | 2019-05-14 |
| 10269700 | Interconnect structure and method of forming the same | Chien-Chih Chiu | 2019-04-23 |
| 10256096 | Self-aligned double patterning | Kuan-Wei Huang, Chia-Ying Lee | 2019-04-09 |
| 10157775 | Method for manufacturing a semiconductor device | Chih-Hao Chen, Jyu-Horng Shieh, Shu-Huei Suen, Wen-Yen Chen | 2018-12-18 |
| 10109486 | Cut first self-aligned litho-etch patterning | Kuan-Wei Huang, Chia-Ying Lee | 2018-10-23 |
| 10090167 | Semiconductor device and method of forming same | Chien-Chih Chiu | 2018-10-02 |
| 9953863 | Methods of forming an interconnect structure | Chun-Te Ho, Chien-Chih Chiu | 2018-04-24 |
| 9917048 | Interconnect structure and method of forming the same | Chien-Chih Chiu | 2018-03-13 |
| 9761451 | Cut last self-aligned litho-etch patterning | Kuan-Wei Huang, Chia-Ying Lee | 2017-09-12 |
| 9728445 | Method for forming conducting via and damascene structure | Wen-Kuo Hsieh | 2017-08-08 |
| 9698016 | Cut first self-aligned litho-etch patterning | Kuan-Wei Huang, Chia-Ying Lee | 2017-07-04 |
| 9496217 | Method and apparatus of forming a via | Hsin-Yi Tsai, Chih-Hao Chen, Chii-Ping Chen, Lai Chien Wen, Yuh-Jier Mii | 2016-11-15 |
| 9425049 | Cut first self-aligned litho-etch patterning | Kuan-Wei Huang, Chia-Ying Lee | 2016-08-23 |
| 9406511 | Self-aligned double patterning | Kuan-Wei Huang, Chia-Ying Lee | 2016-08-02 |
| 9368349 | Cut last self-aligned litho-etch patterning | Kuan-Wei Huang, Chia-Ying Lee | 2016-06-14 |
| 9305839 | Curing photo resist for improving etching selectivity | Wen-Kuo Hsieh, Tsung-Hung Chu | 2016-04-05 |