Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237214 | Method of forming a semiconductor device | Yi-Nien Su, Jyu-Horng Shieh, Ru-Gun Liu | 2025-02-25 |
| 12217936 | DC bias in plasma process | Sheng-Liang Pan, Bing Chen, Chia-Yang Hung, Jyu-Horng Shieh, Syun-Ming Jang +1 more | 2025-02-04 |
| 12153350 | Method of manufacturing semiconductor devices | Ru-Gun Liu, Huicheng Chang, Chia-Cheng Chen, Jyu-Horng Shieh, Liang-Yin Chen +7 more | 2024-11-26 |
| 11854766 | DC bias in plasma process | Sheng-Liang Pan, Bing Chen, Chia-Yang Hung, Jyu-Horng Shieh, Syun-Ming Jang +1 more | 2023-12-26 |
| 11796922 | Method of manufacturing semiconductor devices | Ru-Gun Liu, Huicheng Chang, Chia-Cheng Chen, Jyu-Horng Shieh, Liang-Yin Chen +7 more | 2023-10-24 |
| 11735469 | Method of forming a semiconductor device | Yi-Nien Su, Jyu-Horng Shieh, Ru-Gun Liu | 2023-08-22 |
| 11626292 | Pattern formation method and method for manufacturing a semiconductor device | Yi-Chang Lee, Jiann-Horng Lin, Chih-Hao Chen, Ying Wu, Wen-Yen Chen +1 more | 2023-04-11 |
| 11404245 | DC bias in plasma process | Sheng-Liang Pan, Bing Chen, Chia-Yang Hung, Jyu-Horng Shieh, Syun-Ming Jang +1 more | 2022-08-02 |
| 11322393 | Method of forming a semiconductor device | Yi-Nien Su, Jyu-Horng Shieh, Ru-Gun Liu | 2022-05-03 |
| 10943791 | Pattern formation method and method for manufacturing a semiconductor device | Yi-Chang Lee, Jiann-Horng Lin, Chih-Hao Chen, Ying Wu, Wen-Yen Chen +1 more | 2021-03-09 |
| 10867840 | Method of forming a semiconductor device | Yi-Nien Su, Jyu-Horng Shieh, Ru-Gun Liu | 2020-12-15 |
| 10755945 | Metal contacts on metal gates and methods thereof | Pang-Sheng Chang, Yu-Feng Yin, Chao-Hsun Wang, Kuo-Yi Chao, Fu-Kai Yang +9 more | 2020-08-25 |
| 10510553 | Dry ashing by secondary excitation | Jack Kuo-Ping Kuo, Sheng-Liang Pan, Chia-Yang Hung, Jyu-Horng Shieh, Syun-Ming Jang | 2019-12-17 |
| 10157775 | Method for manufacturing a semiconductor device | Chih-Hao Chen, Jyu-Horng Shieh, Ming-Chung Liang, Wen-Yen Chen | 2018-12-18 |
| 9484207 | Semiconductor device structure and method for forming the same | Jeng Chang Her, Chia-Cheng Lin, Hung Jui Chang, Yu-Sheng Su | 2016-11-01 |
| 9472444 | Wafer support device | Tien-Chih Cheng, Ying Zhang, Chen-Chiao Kao | 2016-10-18 |
| 8544651 | Wafer transfer pod for reducing wafer particulate contamination | Ying Zhang, Tien-Chih Cheng, Yu-Cheng Liu, Jian-Huah Chiou | 2013-10-01 |
| 7001836 | Two step trench definition procedure for formation of a dual damascene opening in a stack of insulator layers | Fu-Kai Yang | 2006-02-21 |
| 6500725 | Microelectronic fabrication method providing alignment mark and isolation trench of identical depth | Chien-Chuan Chen, Chiang-Jen Peng, Bin Su | 2002-12-31 |