Issued Patents All Time
Showing 1–25 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308369 | Method of manufacturing a semiconductor device and a semiconductor device | Ya-Wen Chiu, Yi Che Chan, Lun-Kuang Tan, Zheng-Yang Pan, Cheng-Po Chau +3 more | 2025-05-20 |
| 12288721 | Fin bending reduction through structure design | Ming-Feng Hsieh, Hsueh-Chang Sung, Pei-Ren Jeng, Yee-Chia Yeo, Chien-Chia Cheng | 2025-04-29 |
| 12283622 | Semiconductor device and method | Cheng-Po Chau, Yun Chen Teng | 2025-04-22 |
| 12183590 | Method of performing gap filling including filling trenches between dummy gate stacks on semiconductor fins/strips with semiconductor material | Chien-Hao Chen, Chia-Ao Chang, Pin-Ju Liang | 2024-12-31 |
| 11901442 | Method of manufacturing a semiconductor device and a semiconductor device | Ya-Wen Chiu, Yi Che Chan, Lun-Kuang Tan, Zheng-Yang Pan, Cheng-Po Chau +3 more | 2024-02-13 |
| 11728406 | Semiconductor device and method | Cheng-Po Chau, Yun Chen Teng | 2023-08-15 |
| 11710777 | Semiconductor device and method for manufacture | Chia-Ao Chang, Chii-Horng Li, Yee-Chia Yeo, Hsueh-Chang Sung, Pei-Ren Jeng | 2023-07-25 |
| 11677015 | Method of manufacturing a semiconductor device and a semiconductor device | Ya-Wen Chiu, Yi Che Chan, Lun-Kuang Tan, Zheng-Yang Pan, Cheng-Po Chau +3 more | 2023-06-13 |
| 11605543 | Method of gap filling using conformal deposition-annealing-etching cycle for reducing seam void and bending | Chien-Hao Chen, Chia-Ao Chang, Pin-Ju Liang | 2023-03-14 |
| 11444173 | Semiconductor device structure with salicide layer and method for forming the same | Hsiang-Ku Shen, Jin-Mu Yin, Tsung-Chieh Hsiao, Chia-Lin Chuang, Li-Zhen Yu +14 more | 2022-09-13 |
| 11289343 | Method of gap filling using conformal deposition-annealing-etching cycle for reducing seam void and bending | Chien-Hao Chen, Chia-Ao Chang, Pin-Ju Liang | 2022-03-29 |
| 11205709 | Defect filling in patterned layer | Chia-Ao Chang, Chien-Hao Chen, Yung-Cheng Lu | 2021-12-21 |
| 11183426 | Method for forming a FinFET structure that prevents or reduces deformation of adjacent fins | Yun Chen Teng, Chien-Hao Chen | 2021-11-23 |
| 11114545 | Cap layer and anneal for gapfill improvement | Chien-Hao Chen | 2021-09-07 |
| 11107903 | Selective silicon growth for gapfill improvement | Chien-Hao Chen, Pin-Ju Liang, I-Chen Yang | 2021-08-31 |
| 10868140 | Gap-filling germanium through selective bottom-up growth | Chien-Hao Chen, Ziwei Fang, Yee-Chia Yeo | 2020-12-15 |
| 10868137 | Semiconductor device and method | Cheng-Po Chau, Yun Chen Teng | 2020-12-15 |
| 10861751 | Method of semiconductor integrated circuit fabrication | Chia Ping Lo, Liang-Gi Yao, Weng Chang, Yee-Chia Yeo, Ziwei Fang | 2020-12-08 |
| 10784106 | Selective film growth for bottom-up gap filling | Yu-Lien Huang | 2020-09-22 |
| 10741674 | Selective silicon growth for gapfill improvement | Chien-Hao Chen, Pin-Ju Liang, I-Chen Yang | 2020-08-11 |
| 10727064 | Post UV cure for gapfill improvement | Chien-Hao Chen, Chih-Tang Peng, Jei-Ming Chen, Shu-Yi Wang | 2020-07-28 |
| 10685867 | Method of semiconductor integrated circuit fabrication | Tsu-Hsiu Perng, Ziwei Fang | 2020-06-16 |
| 10535557 | Interlayer dielectric film in semiconductor devices | Tsan-Chun Wang, Ziwei Fang, Yi-Fan Chen | 2020-01-14 |
| 10535751 | Selective silicon growth for gapfill improvement | Chien-Hao Chen, Pin-Ju Liang, I-Chen Yang | 2020-01-14 |
| 10510865 | Cap layer and anneal for gapfill improvement | Chien-Hao Chen | 2019-12-17 |