Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9006909 | Solder mask shape for BOT laminate packages | Sheng-Yu Wu, Pei-Chun Tsai, Tin-Hao Kuo, Chen-Shien Chen | 2015-04-14 |
| 8907479 | Treating copper surfaces for packaging | Tin-Hao Kuo | 2014-12-09 |
| 8853853 | Bump structures | Tin-Hao Kuo, Chen-Shien Chen, Yen-Liang Lin | 2014-10-07 |
| 8823170 | Apparatus and method for three dimensional integrated circuits | Sheng-Yu Wu, Pei-Chun Tsai, Tin-Hao Kuo, Chen-Shien Chen | 2014-09-02 |
| 8803338 | Semiconductor device having under-bump metallization (UBM) structure and method of forming the same | Tsung-Fu Tsai, Yian-Liang Kuo | 2014-08-12 |
| 8710681 | Isolation rings for blocking the interface between package components and the respective molding compound | Tin-Hao Kuo, Tsung-Fu Tsai, Min-Feng Ku | 2014-04-29 |
| 8581420 | Under-bump metallization (UBM) structure and method of forming the same | Tsung-Fu Tsai, Yian-Liang Kuo | 2013-11-12 |
| 8308052 | Thermal gradient reflow for forming columnar grain structures for solder bumps | Yian-Liang Kuo, Chih-Hang Tung, Tsung-Fu Tsai | 2012-11-13 |