Issued Patents All Time
Showing 51–64 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9064881 | Protecting flip-chip package using pre-applied fillet | Yian-Liang Kuo, Ming-Song Sheu, Yu-Ling Tsai, Chen-Shien Chen, Han-Ping Pu | 2015-06-23 |
| 9059158 | Semiconductor device having under-bump metallization (UBM) structure and method of forming the same | Yian-Liang Kuo, Chih-Horng Chang | 2015-06-16 |
| 9048333 | Isolation rings for packages and the method of forming the same | Chih-Horng Chang, Tin-Hao Kuo, Min-Feng Ku | 2015-06-02 |
| 8994155 | Packaging devices, methods of manufacture thereof, and packaging methods | Yu-Chang Lin, Ying-Ching Shih, Wei Wu, Yian-Liang Kuo, Chia-Wei Tu | 2015-03-31 |
| 8846548 | Post-passivation interconnect structure and methods for forming the same | Chia-Wei Tu, Yian-Liang Kuo, Wei-Lun Hsieh | 2014-09-30 |
| 8803338 | Semiconductor device having under-bump metallization (UBM) structure and method of forming the same | Yian-Liang Kuo, Chih-Horng Chang | 2014-08-12 |
| 8710681 | Isolation rings for blocking the interface between package components and the respective molding compound | Chih-Horng Chang, Tin-Hao Kuo, Min-Feng Ku | 2014-04-29 |
| 8581399 | Metal bump structure | Min-Feng Ku, Yian-Liang Kuo | 2013-11-12 |
| 8581420 | Under-bump metallization (UBM) structure and method of forming the same | Yian-Liang Kuo, Chih-Horng Chang | 2013-11-12 |
| 8575754 | Micro-bump structure | Tao-Chih Chang, Chau-Jie Zhan | 2013-11-05 |
| 8569886 | Methods and apparatus of under bump metallization in packaging semiconductor devices | Chia-Wei Tu, Yian-Liang Kuo, Ru-Ying Huang, Ming-Song Sheu, Hsien-Wei Chen | 2013-10-29 |
| 8308052 | Thermal gradient reflow for forming columnar grain structures for solder bumps | Chih-Horng Chang, Yian-Liang Kuo, Chih-Hang Tung | 2012-11-13 |
| 8222800 | Stacked-type piezoelectric device and method for manufacturing the same | Wen-Chih Chen, Huan-Chun Fu | 2012-07-17 |
| 8130509 | Package carrier | Chau-Jie Zhan, Jing-Yao Chang, Tao-Chih Chang | 2012-03-06 |