Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9391049 | Molding package assembly and molding material | Yu-Min Lin | 2016-07-12 |
| 9024441 | Bump structure and electronic packaging solder joint structure and fabricating method thereof | Yu-Min Lin, Tao-Chih Chang | 2015-05-05 |
| 8598686 | Electronic device package structure with a hydrophilic protection layer and method for fabricating the same | Tao-Chih Chang, Su-Tsai Lu, Jing-Yao Chang | 2013-12-03 |
| 8575754 | Micro-bump structure | Tsung-Fu Tsai, Tao-Chih Chang | 2013-11-05 |
| 8415795 | Semiconductor device and assembling method thereof | Yu-Min Lin, Su-Tsai Lu | 2013-04-09 |
| 8130509 | Package carrier | Tsung-Fu Tsai, Jing-Yao Chang, Tao-Chih Chang | 2012-03-06 |