Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9620430 | Sawing underfill in packaging processes | Szu-Wei Lu, Ying-Da Wang, Jing-Cheng Lin | 2017-04-11 |
| 8963334 | Die-to-die gap control for semiconductor structure and method | Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih, Ying-Da Wang, Long Hua Lee +2 more | 2015-02-24 |
| 8828848 | Die structure and method of fabrication thereof | Jing-Cheng Lin, Ying-Da Wang, Szu-Wei Lu | 2014-09-09 |
| 7615603 | Hole or electron injection polymers and prepolymers, hole or electron transport polymers and prepolymers, method for forming the same, and their application | Kuo-Huang Hsieh, Man-Kit Leung, Chao-Hui Kuo, Kuei-Hui Yang, Jiun-Haw Lee +1 more | 2009-11-10 |