Issued Patents All Time
Showing 51–75 of 182 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11276656 | Integrated fan-out structure and method of forming | Hsien-Wei Chen, Tsung-Shu Lin | 2022-03-15 |
| 11264363 | Chip package structure with seal ring structure | Chen-Hua Yu, Jing-Cheng Lin, Po-Hao Tsai | 2022-03-01 |
| 11251071 | Raised via for terminal connections on different planes | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2022-02-15 |
| 11217570 | Package structure and manufacturing method thereof | Wei-Yu Chen, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai +2 more | 2022-01-04 |
| 11177238 | Semiconductor structure | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Tien-Chung Yang | 2021-11-16 |
| 11177142 | Method for dicing integrated fan-out packages without seal rings | Li-Hsien Huang, Yueh-Ting Lin, Ming-Shih Yeh, Der-Chyang Yeh | 2021-11-16 |
| 11158619 | Redistribution layers in semiconductor packages and methods of forming same | Li-Hsien Huang, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh | 2021-10-26 |
| 11145633 | Semiconductor package and manufacturing method thereof | Wei-Yu Chen, Li-Hsien Huang, Tien-Chung Yang, Ming-Shih Yeh | 2021-10-12 |
| 11133197 | Semiconductor structure and method of forming | Wei-Yu Chen, Tien-Chung Yang, Hsien-Wei Chen | 2021-09-28 |
| 11133258 | Package with bridge die for interconnection and method forming same | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Tsung-Shu Lin | 2021-09-28 |
| 11094680 | Packages and methods of forming packages | Chen-Hua Yu, Der-Chyang Yeh | 2021-08-17 |
| 11075182 | Semiconductor package and method of forming the same | Hsien-Wei Chen | 2021-07-27 |
| 11075150 | Semiconductor package and method of manufacturing the same | Li-Hsien Huang, Der-Chyang Yeh, Hua-Wei Tseng, Chiang-Hung Lin, Ming-Shih Yeh | 2021-07-27 |
| 11062978 | Semiconductor package and method | Wei-Yu Chen, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2021-07-13 |
| 11037899 | Package structures and methods of forming the same | Li-Hsien Huang, Hsien-Wei Chen | 2021-06-15 |
| 11018069 | Underfill control structures and method | Ying-Ju Chen, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2021-05-25 |
| 11011464 | Package structures and method of forming the same | Chen-Hua Yu | 2021-05-18 |
| 10992100 | Semiconductor device and method | Chen-Hua Yu, Chia-Nan Yuan, Shih-Guo Shen, Der-Chyang Yeh, Yu-Hung Lin +1 more | 2021-04-27 |
| 10950575 | Package structure and method of forming the same | Chen-Hua Yu, Li-Hsien Huang, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen +1 more | 2021-03-16 |
| 10943889 | Semiconductor device and method of manufacture | Hsien-Wei Chen, Ying-Ju Chen, Jie Chen | 2021-03-09 |
| 10943798 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Wei-Yu Chen | 2021-03-09 |
| 10879224 | Package structure, die and method of manufacturing the same | Wei-Yu Chen, Der-Chyang Yeh, Hua-Wei Tseng, Li-Hsien Huang, Ming-Shih Yeh | 2020-12-29 |
| 10872855 | Chip package and method of fabricating the same | Guan-Yu Chen, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2020-12-22 |
| 10867878 | Dam for three-dimensional integrated circuit | Tsung-Ding Wang, Chien Ling Hwang, Jung Wei Cheng, Hsin-Yu Pan, Chen-Hua Yu | 2020-12-15 |
| 10867928 | Semiconductor device and manufacturing method thereof | Kuan-Chung Lu, Der-Chyang Yeh, Li-Hsien Huang, Yueh-Ting Lin, Ming-Shih Yeh | 2020-12-15 |