Issued Patents All Time
Showing 76–100 of 182 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854565 | Chip package structure with bump | Wei-Yu Chen, Li-Hsien Huang, Hsien-Wei Chen | 2020-12-01 |
| 10811394 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2020-10-20 |
| 10804247 | Chip package structure with conductive shielding film | Chen-Hua Yu, Jing-Cheng Lin, Po-Hao Tsai | 2020-10-13 |
| 10797038 | Semiconductor package and rework process for the same | Chen-Hua Yu, Shing-Chao Chen, Ching-Hua Hsieh, Chung-Shi Liu, Der-Chyang Yeh +1 more | 2020-10-06 |
| 10796927 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Yu Chen | 2020-10-06 |
| 10784207 | Multi-stacked package-on-package structures | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Wei-Cheng Wu | 2020-09-22 |
| 10784248 | Multi-stack package-on-package structures | Chen-Hua Yu | 2020-09-22 |
| 10777430 | Photonic integrated package and method forming same | Chen-Hua Yu, Wei-Yu Chen | 2020-09-15 |
| 10756037 | Package structure and fabricating method thereof | Li-Hsien Huang, Der-Chyang Yeh, Hua-Wei Tseng, Yueh-Ting Lin, Ming-Shih Yeh | 2020-08-25 |
| 10741490 | Device and package structure | Hsien-Wei Chen, Li-Hsien Huang | 2020-08-11 |
| 10734357 | Chip package structure with molding layer | Wei-Yu Chen, Li-Hsien Huang, Hsien-Wei Chen | 2020-08-04 |
| 10720409 | Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Hsien Huang, Yueh-Ting Lin +1 more | 2020-07-21 |
| 10679951 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Tzu-Shiun Sheu, Shin-Puu Jeng, Shih-Peng Tai, Chi-Hsi Wu | 2020-06-09 |
| 10679953 | Integrated fan-out structure and method of forming | Hsien-Wei Chen, Tsung-Shu Lin | 2020-06-09 |
| 10672734 | Package structures and methods of forming the same | Li-Hsien Huang, Hsien-Wei Chen | 2020-06-02 |
| 10672741 | Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Hsien Huang, Yueh-Ting Lin +1 more | 2020-06-02 |
| 10658339 | Semiconductor device and method of manufacture | Hsien-Wei Chen, Ying-Ju Chen, Jie Chen | 2020-05-19 |
| 10658337 | Packages and packaging methods for semiconductor devices, and packaged semiconductor devices | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen, Der-Chyang Yeh | 2020-05-19 |
| 10643965 | Structure and method of forming a joint assembly | Ying-Ju Chen, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2020-05-05 |
| 10643864 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Wei-Yu Chen | 2020-05-05 |
| 10636775 | Package structure and manufacturing method thereof | Wei-Yu Chen, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai +2 more | 2020-04-28 |
| 10629477 | Raised via for terminal connections on different planes | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2020-04-21 |
| 10622302 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2020-04-14 |
| 10541226 | Package structure and method of forming the same | Chen-Hua Yu, Li-Hsien Huang, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen +1 more | 2020-01-21 |
| 10529650 | Semiconductor package and method | Wei-Yu Chen, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2020-01-07 |