Issued Patents All Time
Showing 126–150 of 182 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157835 | Package structures and method of forming the same | Chen-Hua Yu | 2018-12-18 |
| 10109607 | Under bump metallurgy (UBM) and methods of forming same | Wei-Yu Chen, Hsien-Wei Chen, Cheng-Hsien Hsieh | 2018-10-23 |
| 10103125 | Chip package structure and method for forming the same | Chen-Hua Yu, Jing-Cheng Lin, Po-Hao Tsai | 2018-10-16 |
| 10096563 | Semiconductor package and method of forming the same | Hsien-Wei Chen | 2018-10-09 |
| 10096553 | Metal pad for laser marking | Hsien-Wei Chen | 2018-10-09 |
| 10090241 | Device, package structure and method of forming the same | Hsien-Wei Chen, Li-Hsien Huang | 2018-10-02 |
| 10090284 | Semiconductor device and method of manufacture | Wei-Yu Chen, Tien-Chung Yang, Hsien-Wei Chen | 2018-10-02 |
| 10083927 | Chip package structure with bump | Wei-Yu Chen, Li-Hsien Huang, Hsien-Wei Chen | 2018-09-25 |
| 10074631 | Packages and packaging methods for semiconductor devices, and packaged semiconductor devices | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen, Der-Chyang Yeh | 2018-09-11 |
| 10020236 | Dam for three-dimensional integrated circuit | Tsung-Ding Wang, Chien Ling Hwang, Jung Wei Cheng, Hsin-Yu Pan, Chen-Hua Yu | 2018-07-10 |
| 10008460 | Semiconductor package and method of forming the same | Hsien-Wei Chen | 2018-06-26 |
| 9984998 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2018-05-29 |
| 9984969 | Semiconductor devices, multi-die packages, and methods of manufacure thereof | Chen-Hua Yu, Hsien-Wei Chen, Chi-Hsi Wu, Der-Chyang Yeh, Shih-Peng Tai | 2018-05-29 |
| 9953963 | Integrated circuit process having alignment marks for underfill | Hsien-Wei Chen, Wei-Yu Chen | 2018-04-24 |
| 9941248 | Package structures, pop devices and methods of forming the same | Tien-Chung Yang, Hsien-Wei Chen, Jo-Mei Wang, Wei-Yu Chen | 2018-04-10 |
| 9929071 | Dicing in wafer level package | Chia-Shen Cheng, Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng +1 more | 2018-03-27 |
| 9929069 | Semiconductor device and manufacturing method thereof | Tien-Chung Yang, Lin-Chih Huang, Hsien-Wei Chen, Li-Hsien Huang | 2018-03-27 |
| 9922943 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Tzu-Shiun Sheu, Shin-Puu Jeng, Shih-Peng Tai, Chi-Hsi Wu | 2018-03-20 |
| 9922939 | Wafer level shielding in multi-stacked fan out packages and methods of forming same | Wei-Yu Chen, Hsien-Wei Chen, Jo-Mei Wang, Tien-Chung Yang | 2018-03-20 |
| 9859258 | Semiconductor device and method of manufacture | Wei-Yu Chen, Tien-Chung Yang, Hsien-Wei Chen | 2018-01-02 |
| 9859245 | Chip package structure with bump and method for forming the same | Wei-Yu Chen, Li-Hsien Huang, Hsien-Wei Chen | 2018-01-02 |
| 9852957 | Testing, manufacturing, and packaging methods for semiconductor devices | Li-Hsien Huang, Yung-Shou Cheng, Yan-Fu Lin, Wei-Cheng Wu, Chin-Hsien Chen +2 more | 2017-12-26 |
| 9842829 | Chip package structure and method for forming the same | Shao-Yun Chen, Hsien-Wei Chen | 2017-12-12 |
| 9842788 | Underfill control structures and method | Ying-Ju Chen, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2017-12-12 |
| 9831215 | Semiconductor package and forming method thereof | Hsien-Wei Chen, Li-Hsien Huang, Wei-Yu Chen, Ying-Ju Chen | 2017-11-28 |