Issued Patents All Time
Showing 151–175 of 182 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9825007 | Chip package structure with molding layer and method for forming the same | Wei-Yu Chen, Li-Hsien Huang, Hsien-Wei Chen | 2017-11-21 |
| 9812430 | Package on-package method | Hsien-Wei Chen, Ying-Ju Chen | 2017-11-07 |
| 9812337 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Yu Chen | 2017-11-07 |
| 9806059 | Multi-stack package-on-package structures | Chi-Jung Lee, Hsien-Wei Chen, Wei-Yu Chen, Tien-Chung Yang, Li-Hsien Huang | 2017-10-31 |
| 9793246 | Pop devices and methods of forming the same | Hua-Wei Tseng, Hsien-Wei Chen, Li-Hsien Huang, Tien-Chung Yang | 2017-10-17 |
| 9793231 | Under bump metallurgy (UBM) and methods of forming same | Wei-Yu Chen, Hsien-Wei Chen, Cheng-Hsien Hsieh | 2017-10-17 |
| 9793245 | Semiconductor device and method of manufacture | Hsien-Wei Chen, Ying-Ju Chen, Jie Chen | 2017-10-17 |
| 9786614 | Integrated fan-out structure and method of forming | Hsien-Wei Chen, Tsung-Shu Lin | 2017-10-10 |
| 9786599 | Package structures and method of forming the same | Chen-Hua Yu | 2017-10-10 |
| 9735131 | Multi-stack package-on-package structures | Chen-Hua Yu | 2017-08-15 |
| 9728522 | Integrated circuit packages and methods of forming same | Hsien-Wei Chen | 2017-08-08 |
| 9728498 | Package structure | Hsien-Wei Chen | 2017-08-08 |
| 9691840 | Cylindrical embedded capacitors | Chi-Chun Hsieh, Tzu-Yu Wang, Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou +2 more | 2017-06-27 |
| 9679839 | Chip on package structure and method | Der-Chyang Yeh, Hsien-Wei Chen | 2017-06-13 |
| 9659878 | Wafer level shielding in multi-stacked fan out packages and methods of forming same | Wei-Yu Chen, Hsien-Wei Chen, Jo-Mei Wang, Tien-Chung Yang | 2017-05-23 |
| 9659863 | Semiconductor devices, multi-die packages, and methods of manufacture thereof | Chen-Hua Yu, Hsien-Wei Chen, Chi-Hsi Wu, Der-Chyang Yeh, Shih-Peng Tai | 2017-05-23 |
| 9646955 | Packages and methods of forming packages | Chen-Hua Yu, Der-Chyang Yeh | 2017-05-09 |
| 9640496 | Semiconductor device | Wei-Yu Chen, Hsien-Wei Chen, Cheng-Hsien Hsieh | 2017-05-02 |
| 9613910 | Anti-fuse on and/or in package | Hsien-Wei Chen | 2017-04-04 |
| 9589900 | Metal pad for laser marking | Hsien-Wei Chen | 2017-03-07 |
| 9583415 | Packages with thermal interface material on the sidewalls of stacked dies | Chen-Hua Yu, Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen +2 more | 2017-02-28 |
| 9570322 | Integrated circuit packages and methods of forming same | Hsien-Wei Chen | 2017-02-14 |
| 9564345 | Semiconductor device and manufacturing method thereof | Tien-Chung Yang, Lin-Chih Huang, Hsien-Wei Chen, Li-Hsien Huang | 2017-02-07 |
| 9524942 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Tzu-Shiun Sheu, Shin-Puu Jeng, Shih-Peng Tai, Chi-Hsi Wu | 2016-12-20 |
| 9502364 | Semiconductor package and method of forming the same | Hsien-Wei Chen | 2016-11-22 |