Issued Patents All Time
Showing 101–125 of 182 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515865 | Underfill control structures and method | Ying-Ju Chen, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2019-12-24 |
| 10510735 | Packages and methods of forming packages | Chen-Hua Yu, Der-Chyang Yeh | 2019-12-17 |
| 10510715 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Tien-Chung Yang | 2019-12-17 |
| 10510556 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Yu Chen | 2019-12-17 |
| 10490540 | Multi-stack package-on-package structures | Chen-Hua Yu | 2019-11-26 |
| 10461036 | Multi-stacked package-on-package structures | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Wei-Cheng Wu | 2019-10-29 |
| 10366959 | Integrated fan-out structure and method of forming | Hsien-Wei Chen, Tsung-Shu Lin | 2019-07-30 |
| 10347606 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2019-07-09 |
| 10340155 | Semiconductor structure and method of forming | Wei-Yu Chen, Tien-Chung Yang, Hsien-Wei Chen | 2019-07-02 |
| 10319683 | Multi-stacked package-on-package structures | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Wei-Cheng Wu | 2019-06-11 |
| 10304801 | Redistribution layers in semiconductor packages and methods of forming same | Li-Hsien Huang, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh | 2019-05-28 |
| 10297471 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Wei-Yu Chen | 2019-05-21 |
| 10297494 | Raised via for terminal connections on different planes | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2019-05-21 |
| 10290610 | PoP device and method of forming the same | Li-Hsien Huang, Der-Chyang Yeh, Hua-Wei Tseng, Li-Hui Cheng, Po-Hao Tsai +2 more | 2019-05-14 |
| 10283479 | Package structures and methods of forming the same | Li-Hsien Huang, Hsien-Wei Chen | 2019-05-07 |
| 10283375 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Yu Chen | 2019-05-07 |
| 10276542 | Package structure and manufacturing method thereof | Li-Hsien Huang, Hsien-Wei Chen, Hua-Wei Tseng, Jo-Mei Wang, Tien-Chung Yang +1 more | 2019-04-30 |
| 10217687 | Semiconductor device and manufacturing method thereof | Tien-Chung Yang, Lin-Chih Huang, Hsien-Wei Chen, Li-Hsien Huang | 2019-02-26 |
| 10177032 | Devices, packaging devices, and methods of packaging semiconductor devices | Hsien-Wei Chen, Jo-Mei Wang | 2019-01-08 |
| 10163822 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Tzu-Shiun Sheu, Shin-Puu Jeng, Shih-Peng Tai, Chi-Hsi Wu | 2018-12-25 |
| 10163701 | Multi-stack package-on-package structures | Chi-Jung Lee, Hsien-Wei Chen, Wei-Yu Chen, Tien-Chung Yang, Li-Hsien Huang | 2018-12-25 |
| 10163803 | Integrated fan-out packages and methods of forming the same | Wei-Yu Chen, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2018-12-25 |
| 10163866 | Semiconductor device and method of manufacture | Hsien-Wei Chen, Ying-Ju Chen, Jie Chen | 2018-12-25 |
| 10157899 | Packages and methods of forming packages | Chen-Hua Yu, Der-Chyang Yeh | 2018-12-18 |
| 10157852 | Multi-stacked package-on-package structures | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Wei-Cheng Wu | 2018-12-18 |