Issued Patents All Time
Showing 176–182 of 182 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484227 | Dicing in wafer level package | Chia-Shen Cheng, Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng +1 more | 2016-11-01 |
| 9478443 | Semiconductor package and method of forming the same | Hsien-Wei Chen | 2016-10-25 |
| 9478521 | Package-on-package Structure | Hsien-Wei Chen, Ying-Ju Chen | 2016-10-25 |
| 9293442 | Semiconductor package and method | Hsien-Wei Chen | 2016-03-22 |
| 8847388 | Bump with protection structure | Chen-Hua Yu, Hung-Pin Chang, Tsang-Jiuh Wu, Wen-Chih Chiou, Shin-Puu Jeng | 2014-09-30 |
| 8693163 | Cylindrical embedded capacitors | Chi-Chun Hsieh, Tzu-Yu Wang, Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou +2 more | 2014-04-08 |
| 8294264 | Radiate under-bump metallization structure for semiconductor devices | Tzu-Yu Wang, Chi-Chun Hsieh, Hsien-Wei Chen, Shin-Puu Jeng, Liwei Lin | 2012-10-23 |