Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224247 | Fan-out package having a main die and a dummy die | Chen-Hua Yu, Meng-Tsan Lee, Wei-Cheng Wu, Hsien-Wei Chen | 2025-02-11 |
| 11967563 | Fan-out package having a main die and a dummy die | Chen-Hua Yu, Meng-Tsan Lee, Wei-Cheng Wu, Hsien-Wei Chen | 2024-04-23 |
| 11094641 | Fan-out package having a main die and a dummy die | Chen-Hua Yu, Meng-Tsan Lee, Wei-Cheng Wu, Hsien-Wei Chen | 2021-08-17 |
| 10510674 | Fan-out package having a main die and a dummy die, and method of forming | Chen-Hua Yu, Meng-Tsan Lee, Wei-Cheng Wu, Hsien-Wei Chen | 2019-12-17 |
| 10163802 | Fan-out package having a main die and a dummy die, and method of forming | Chen-Hua Yu, Meng-Tsan Lee, Wei-Cheng Wu, Hsien-Wei Chen | 2018-12-25 |
| 9852957 | Testing, manufacturing, and packaging methods for semiconductor devices | Li-Hsien Huang, Yung-Shou Cheng, An-Jhih Su, Wei-Cheng Wu, Chin-Hsien Chen +2 more | 2017-12-26 |
| 9812426 | Integrated fan-out package, semiconductor device, and method of fabricating the same | Chin-Te Wang, Cheng-Hsien Hsieh, Hsien-Wei Chen, Li-Han Hsu, Tzu-Shiun Sheu +1 more | 2017-11-07 |
| 9093314 | Copper bump structures having sidewall protection layers | Jing-Cheng Lin, Ya-Hsi Hwung, Hsin-Yu Chen, Po-Hao Tsai, Cheng-Lin Huang +2 more | 2015-07-28 |
| 8922004 | Copper bump structures having sidewall protection layers | Jing-Cheng Lin, Ya-Hsi Hwung, Hsin-Yu Chen, Po-Hao Tsai, Cheng-Lin Huang +2 more | 2014-12-30 |
| 8629568 | Semiconductor device cover mark | Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu | 2014-01-14 |