Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9093314 | Copper bump structures having sidewall protection layers | Jing-Cheng Lin, Hsin-Yu Chen, Po-Hao Tsai, Yan-Fu Lin, Cheng-Lin Huang +2 more | 2015-07-28 |
| 8922004 | Copper bump structures having sidewall protection layers | Jing-Cheng Lin, Hsin-Yu Chen, Po-Hao Tsai, Yan-Fu Lin, Cheng-Lin Huang +2 more | 2014-12-30 |