Issued Patents All Time
Showing 26–50 of 182 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837587 | Package structure and manufacturing method thereof | Wei-Yu Chen, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai +2 more | 2023-12-05 |
| 11756931 | Chip package structure with molding layer | Wei-Yu Chen, Li-Hsien Huang, Hsien-Wei Chen | 2023-09-12 |
| 11742323 | Semiconductor structure and method of forming the same | Chih-Chien Pan, Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2023-08-29 |
| 11728249 | Semiconductor package and method | Wei-Yu Chen, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2023-08-15 |
| 11721559 | Integrated circuit package pad and methods of forming | Chen-Hua Yu, Hsien-Wei Chen, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Yu Chen | 2023-08-08 |
| 11715727 | Packages and methods of forming packages | Chen-Hua Yu, Der-Chyang Yeh | 2023-08-01 |
| 11664322 | Multi-stacked package-on-package structures | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Wei-Cheng Wu | 2023-05-30 |
| 11646220 | Raised via for terminal connections on different planes | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2023-05-09 |
| 11626296 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Wei-Yu Chen | 2023-04-11 |
| 11587900 | Package structure including IPD and method of forming the same | Hua-Wei Tseng, Yueh-Ting Lin, Shao-Yun Chen, Li-Hsien Huang, Ming-Shih Yeh +1 more | 2023-02-21 |
| 11527419 | Photonic integrated package and method forming same | Chen-Hua Yu, Wei-Yu Chen | 2022-12-13 |
| 11502032 | Chip package and method of fabricating the same | Guan-Yu Chen, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2022-11-15 |
| 11482497 | Package structure including a first die and a second die and a bridge die and method of forming the package structure | Yu-Hung Lin, Chih-Wei Wu, Chia-Nan Yuan, Ying-Ching Shih, Szu-Wei Lu +2 more | 2022-10-25 |
| 11469218 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2022-10-11 |
| 11469138 | Via for coupling attached component upper electrode to substrate | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2022-10-11 |
| 11469215 | Chip package structure with molding layer and method for forming the same | Wei-Yu Chen | 2022-10-11 |
| 11462531 | Multi-stack package-on-package structures | Chen-Hua Yu | 2022-10-04 |
| 11462530 | Multi-stack package-on-package structures | Chen-Hua Yu | 2022-10-04 |
| 11450612 | Semiconductor devices and methods of manufacturing the same | Yu-Hung Lin, Der-Chyang Yeh, Shih-Guo Shen, Chia-Nan Yuan, Ming-Shih Yeh | 2022-09-20 |
| 11444034 | Redistribution structure for integrated circuit package and method of forming same | Chen-Hua Yu, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2022-09-13 |
| 11444021 | Device and package structure and method of forming the same | Hsien-Wei Chen, Li-Hsien Huang | 2022-09-13 |
| 11444020 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2022-09-13 |
| 11410956 | Chip package structure with bump | Wei-Yu Chen, Li-Hsien Huang, Hsien-Wei Chen | 2022-08-09 |
| 11355468 | Structure and method of forming a joint assembly | Ying-Ju Chen, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2022-06-07 |
| 11342196 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Yu Chen | 2022-05-24 |