Issued Patents All Time
Showing 51–75 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9514986 | Device with capped through-substrate via structure | Yen-Hung Chen, Yin Chen, Ebin Liao, Ku-Feng Yang, Tsang-Jiuh Wu +1 more | 2016-12-06 |
| 9449898 | Semiconductor device having backside interconnect structure through substrate via and method of forming the same | Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih, Chia-Yin Chen +3 more | 2016-09-20 |
| 9425067 | Method for forming package systems having interposers | Jing-Cheng Lin, Chen-Hua Yu | 2016-08-23 |
| 9425126 | Dummy structure for chip-on-wafer-on-substrate | Pei-Ching Kuo, Yi-Hsiu Chen, Jun-Lin Yeh, Li-Han Hsu, Wei-Cheng Wu +2 more | 2016-08-23 |
| 9418933 | Through-substrate via formation with improved topography control | Yi-Hsiu Chen, Ku-Feng Yang, Wen-Chih Chiou | 2016-08-16 |
| 9373575 | TSV structures and methods for forming the same | Hsin-Yu Chen, Wen-Chih Chiou, Ku-Feng Yang, Tsang-Jiuh Wu, Jing-Cheng Lin | 2016-06-21 |
| 9343390 | TSV formation processes using TSV-last approach | Jing C. Lin, Ku-Feng Yang | 2016-05-17 |
| 9287440 | Method of manufacturing a semiconductor device including through silicon plugs | Chen-Hua Yu, Hung-Pin Chang, Chia-Lin Yu, Jui-Pin Hung, Chien Ling Hwang | 2016-03-15 |
| 9252110 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Ku-Feng Yang +2 more | 2016-02-02 |
| 9171815 | Method of forming package systems having interposers | Jing-Cheng Lin, Chen-Hua Yu | 2015-10-27 |
| 9112007 | Through via structure and method | Hsin-Yu Chen, Lin-Chih Huang, Tsang-Jiuh Wu, Wen-Chih Chiou | 2015-08-18 |
| 9064850 | Through-substrate via formation with improved topography control | Yi-Hsiu Chen, Ku-Feng Yang, Wen-Chih Chiou | 2015-06-23 |
| 8980741 | Through silicon via with embedded barrier pad | Sylvia Lo, Jing-Cheng Lin, Yen-Hung Chen, Wen-Chih Chiou | 2015-03-17 |
| 8956966 | TSV structures and methods for forming the same | Hsin-Yu Chen, Wen-Chih Chiou, Ku-Feng Yang, Tsang-Jiuh Wu, Jing-Cheng Lin | 2015-02-17 |
| 8946742 | Semiconductor package with through silicon vias | Chen-Hua Yu, Hung-Pin Chang, Chia-Lin Yu, Jui-Pin Hung, Chien Ling Hwang | 2015-02-03 |
| 8866301 | Package systems having interposers with interconnection structures | Jing-Cheng Lin, Chen-Hua Yu | 2014-10-21 |
| 8846523 | Process of forming through-silicon via structure | Weng-Jin Wu, Wen-Chih Chiou | 2014-09-30 |
| 8836085 | Cost-effective TSV formation | Ku-Feng Yang, Hung-Pin Chang, Tsang-Jiuh Wu, Wen-Chih Chiou | 2014-09-16 |
| 8803316 | TSV structures and methods for forming the same | Hsin-Yu Chen, Wen-Chih Chiou, Ku-Feng Yang, Tsang-Jiuh Wu, Jing-Cheng Lin | 2014-08-12 |
| 8791011 | Through-silicon via structure formation process | Weng-Jin Wu, Shau-Lin Shue | 2014-07-29 |
| 8772945 | Through silicon via with embedded barrier pad | Wen-Chih Chiou, Yen-Hung Chen, Sylvia Lo, Jing-Cheng Lin | 2014-07-08 |
| 8580682 | Cost-effective TSV formation | Ku-Feng Yang, Hung-Pin Chang, Tsang-Jiuh Wu, Wen-Chih Chiou | 2013-11-12 |
| 8507940 | Heat dissipation by through silicon plugs | Chen-Hua Yu, Hung-Pin Chang, Chia-Lin Yu, Jui-Pin Hung, Chien Ling Hwang | 2013-08-13 |
| 8432038 | Through-silicon via structure and a process for forming the same | Weng-Jin Wu, Wen-Chih Chiou | 2013-04-30 |
| 8405201 | Through-silicon via structure | Weng-Jin Wu, Shau-Lin Shue | 2013-03-26 |