Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8980741 | Through silicon via with embedded barrier pad | Yung-Chi Lin, Jing-Cheng Lin, Yen-Hung Chen, Wen-Chih Chiou | 2015-03-17 |
| 8772945 | Through silicon via with embedded barrier pad | Yung-Chi Lin, Wen-Chih Chiou, Yen-Hung Chen, Jing-Cheng Lin | 2014-07-08 |