Issued Patents All Time
Showing 26–50 of 549 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11981990 | Deposition equipment with shielding mechanism | Yu-Te Shen | 2024-05-14 |
| 11972936 | Shielding device and thin-film-deposition equipment with the same | — | 2024-04-30 |
| 11961753 | Substrate-bonding device | Jung-Hua Chang, Mao-Chan Chang | 2024-04-16 |
| 11961724 | Shielding device and thin-film-deposition equipment with the same | Yu-Te Shen | 2024-04-16 |
| 11955459 | Package structure | Shu-Hang Liao, Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih | 2024-04-09 |
| 11952662 | Powder atomic layer deposition equipment with quick release function | Jung-Hua Chang, Chia-Cheng Ku | 2024-04-09 |
| 11935866 | Semiconductor device having reduced bump height variation | Po-Hao Tsai | 2024-03-19 |
| 11929242 | Shielding mechanism and thin-film-deposition equipment using the same | — | 2024-03-12 |
| 11901302 | InFO-POP structures with TIVs having cavities | Chen-Hua Yu, Po-Hao Tsai | 2024-02-13 |
| 11898238 | Shielding device and thin-film-deposition equipment with the same | Yu-Te Shen | 2024-02-13 |
| 11891695 | Vibrating deposition device | — | 2024-02-06 |
| 11891694 | Atomic-layer-deposition equipment and atomiclayer-deposition method by using the same | — | 2024-02-06 |
| 11869792 | Alignment mechanism and alignment method of bonding machine | — | 2024-01-09 |
| 11854998 | Semiconductor device and method of manufacture | Chen-Hua Yu, Po-Hao Tsai | 2023-12-26 |
| 11855047 | Chip package structure with conductive shielding film | Chen-Hua Yu, An-Jhih Su, Po-Hao Tsai | 2023-12-26 |
| 11854826 | Metal oxide layered structure and methods of forming the same | Cheng-Lin Huang | 2023-12-26 |
| 11854877 | Semiconductor device and manufacturing method of the same | Ying-Ching Shih, Pu Wang, Chen-Hua Yu | 2023-12-26 |
| 11854990 | Method for forming a semiconductor device having TSV formed through a silicon interposer and a second silicon substrate with cavity covering a second die | Hsien-Pin Hu, Chen-Hua Yu, Ming-Fa Chen, Jiun-Ren Lai, Yung-Chi Lin | 2023-12-26 |
| 11848225 | Apparatus for edge trimming of semiconductor wafers | — | 2023-12-19 |
| 11848247 | Thermal dissipation through seal rings in 3DIC structure | Shih-Yi Syu | 2023-12-19 |
| 11846022 | Thin-film-deposition machine | Ta-Hao Kuo | 2023-12-19 |
| 11842936 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Long Hua Lee +1 more | 2023-12-12 |
| 11817437 | Method of forming package structure | Po-Hao Tsai | 2023-11-14 |
| 11791241 | Front-to-back bonding with through-substrate via (TSV) | — | 2023-10-17 |
| 11784094 | Laser lift-off method for separating substrate and semiconductor-epitaxial structure | Tsung-Hua Hsieh | 2023-10-10 |