Issued Patents All Time
Showing 51–75 of 549 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776935 | Semiconductor device and method of manufacture | Chen-Hua Yu, Po-Hao Tsai | 2023-10-03 |
| 11773319 | Quantum dot particles with passivation layer and manufacturing method thereof | Jung-Hua Chang | 2023-10-03 |
| 11767591 | Detachable atomic layer deposition apparatus for powders | Jung-Hua Chang, Chia-Cheng Ku | 2023-09-26 |
| 11764139 | Semiconductor device and method | Chi-Hsi Wu, Chen-Hua Yu, Po-Hao Tsai | 2023-09-19 |
| 11756802 | Thermally conductive material in the recess of an encapsulant and sidewall of an integrated circuit device | Li-Hui Cheng, Po-Hao Tsai | 2023-09-12 |
| 11742310 | Method of manufacturing semiconductor device | Feng-Cheng Hsu | 2023-08-29 |
| 11739423 | Atomic layer deposition apparatus for coating on fine powders | Jung-Hua Chang, Ta-Hao Kuo, Chia-Cheng Ku | 2023-08-29 |
| 11735456 | Alignment mechanism and alignment method of bonding machine | Jung-Hua Chang, Mao-Chan Chang | 2023-08-22 |
| 11688728 | Integrated circuit structure and method for reducing polymer layer delamination | Jui-Pin Hung, Hsien-Wen Liu, Min-Chen Lin | 2023-06-27 |
| 11685996 | Atomic layer deposition device | — | 2023-06-27 |
| 11658172 | Hybrid bonding with through substrate via (TSV) | — | 2023-05-23 |
| 11652190 | Semiconductor component with oxidized aluminum nitride film and manufacturing method thereof | — | 2023-05-16 |
| 11646220 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2023-05-09 |
| 11637086 | Sawing underfill in packaging processes | Szu-Wei Lu, Ying-Da Wang, Li-Chung Kuo | 2023-04-25 |
| 11631654 | Sawing underfill in packaging processes | Szu-Wei Lu, Ying-Da Wang, Li-Chung Kuo | 2023-04-18 |
| 11621205 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Long Hua Lee +1 more | 2023-04-04 |
| 11610911 | Semiconductor assemblies including combination memory and methods of manufacturing the same | — | 2023-03-21 |
| 11605579 | Semiconductor device having passivation layer and method of manufacturing the same | Li-Hui Cheng, Po-Hao Tsai | 2023-03-14 |
| 11598006 | Wafer support and thin-film deposition apparatus using the same | Chun-Fu Wang | 2023-03-07 |
| 11596973 | Double-shaft shielding device and thin-film-deposition equipment with the same | Yu-Te Shen | 2023-03-07 |
| 11597999 | Method and device for decreasing generation of surface oxide of aluminum nitride | Yao-Syuan Cheng | 2023-03-07 |
| 11562941 | Semiconductor packages having thermal conductive patterns surrounding the semiconductor die | Szu-Wei Lu | 2023-01-24 |
| 11535938 | Shower head assembly and atomic layer deposition device | CHING-LIANG YI, Yun-Chi Hsu | 2022-12-27 |
| 11538711 | Methods for edge trimming of semiconductor wafers and related apparatus | — | 2022-12-27 |
| 11532469 | Shielding device and thin-film-deposition equipment with the same | Yu-Te Shen | 2022-12-20 |