Issued Patents All Time
Showing 101–125 of 549 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322380 | Substrate transfer system with tray aligner | Jung-Hua Chang | 2022-05-03 |
| 11296011 | Through-substrate vias with improved connections | Ku-Feng Yang | 2022-04-05 |
| 11282793 | Integrated fan-out structure with rugged interconnect | Shih-Ting Lin, Szu-Wei Lu, Chen-Hua Yu | 2022-03-22 |
| 11270976 | Package structure and method of manufacturing the same | Shu-Hang Liao, Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih | 2022-03-08 |
| 11264363 | Chip package structure with seal ring structure | Chen-Hua Yu, An-Jhih Su, Po-Hao Tsai | 2022-03-01 |
| 11257715 | Integrated fan-out packages and methods of forming the same | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu, Long Hua Lee | 2022-02-22 |
| 11251071 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2022-02-15 |
| 11239138 | Methods of packaging semiconductor devices and packaged semiconductor devices | Li-Hui Cheng, Po-Hao Tsai | 2022-02-01 |
| 11205615 | Semiconductor device and method of manufacture | Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Szu-Wei Lu, Ying-Ching Shih | 2021-12-21 |
| 11205579 | Molding wafer chamber | Chin-Chuan Chang, Jui-Pin Hung, Szu-Wei Lu, Shin-Puu Jeng, Chen-Hua Yu | 2021-12-21 |
| 11201135 | Three dimensional integrated circuits stacking approach | Shang-Yun Hou | 2021-12-14 |
| 11183473 | Integrated circuit structure having dies with connectors of different sizes | Shin-Puu Jeng, Chen-Hua Yu | 2021-11-23 |
| 11164852 | Method of forming package structure | Po-Hao Tsai | 2021-11-02 |
| 11164829 | Method of forming contact holes in a fan out package | Feng-Cheng Hsu, Szu-Wei Lu | 2021-11-02 |
| 11158587 | Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices | Po-Hao Tsai, Jui-Pin Hung | 2021-10-26 |
| 11158588 | Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices | Po-Hao Tsai, Jui-Pin Hung | 2021-10-26 |
| 11152316 | Method of forming contact holes in a fan out package | Feng-Cheng Hsu, Szu-Wei Lu | 2021-10-19 |
| 11139285 | Semiconductor package | Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Ying-Ching Shih, Szu-Wei Lu | 2021-10-05 |
| 11133286 | Chip packages and methods of manufacture thereof | Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih | 2021-09-28 |
| 11121118 | Integrated circuit stacking approach | Shang-Yun Hou | 2021-09-14 |
| 11114405 | Semiconductor package structure with twinned copper | Jung-Hua Chang, Po-Hao Tsai | 2021-09-07 |
| 11107798 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Po-Hao Tsai | 2021-08-31 |
| 11101252 | Package-on-package structure and manufacturing method thereof | Shih-Ting Lin, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2021-08-24 |
| 11094639 | Semiconductor package | Po-Hao Tsai, Ying-Ching Shih, Szu-Wei Lu | 2021-08-17 |
| 11081475 | Integrated circuit structure and method for reducing polymer layer delamination | Jui-Pin Hung, Hsien-Wen Liu, Min-Chen Lin | 2021-08-03 |