Issued Patents All Time
Showing 126–150 of 549 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11075168 | InFO-POP structures with TIVs having cavities | Chen-Hua Yu, Po-Hao Tsai | 2021-07-27 |
| 11075133 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Long Hua Lee +1 more | 2021-07-27 |
| 11069673 | Semiconductor package and manufacturing method thereof | Li-Hui Cheng, Po-Hao Tsai | 2021-07-20 |
| 11069653 | Methods and structures for packaging semiconductor dies | Yi-Chao Mao | 2021-07-20 |
| 11062987 | Semiconductor device | Chi-Hsi Wu, Chen-Hua Yu, Po-Hao Tsai | 2021-07-13 |
| 11056471 | Semiconductor device and method of manufacture | Po-Hao Tsai, Li-Hui Cheng, Porter Chen | 2021-07-06 |
| 11056436 | Integrated fan-out structure with rugged interconnect | Shih-Ting Lin, Szu-Wei Lu, Chen-Hua Yu | 2021-07-06 |
| 11037861 | Interconnect structure for package-on-package devices | Jui-Pin Hung, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen, Chiung-Han Yeh +1 more | 2021-06-15 |
| 11037854 | Thermal dissipation through seal rings in 3DIC structure | Shih-Yi Syu | 2021-06-15 |
| 11018106 | Semiconductor device including solder bracing material with a rough surface, and manufacturing method thereof | Feng-Cheng Hsu | 2021-05-25 |
| 10964673 | Semiconductor device and manufacturing method of the same | Ying-Ching Shih, Pu Wang, Chen-Hua Yu | 2021-03-30 |
| 10964594 | Methods of packaging semiconductor devices including placing semiconductor devices into die caves | Jui-Pin Hung, Yi-Hang Lin, Tsan-Hua Tung | 2021-03-30 |
| 10957616 | Package structure and method | Szu-Wei Lu, Chen-Hua Yu | 2021-03-23 |
| 10943873 | Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same | Chen-Hua Yu, Szu-Wei Lu, Yen-Yao Chi | 2021-03-09 |
| 10923431 | Method for forming a 3D IC architecture including forming a first die on a first side of a first interconnect structure and a second die in an opening formed in a second side | Hsien-Pin Hu, Chen-Hua Yu, Ming-Fa Chen, Jiun-Ren Lai, Yung-Chi Lin | 2021-02-16 |
| 10916488 | Semiconductor package having thermal conductive pattern surrounding the semiconductor die | Szu-Wei Lu | 2021-02-09 |
| 10916450 | Package of integrated circuits having a light-to-heat-conversion coating material | Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Szu-Wei Lu, Ying-Ching Shih | 2021-02-09 |
| 10910267 | Alignment marks in substrate having through-substrate via (TSV) | Hsin Chang, Fang Wen Tsai, Wen-Chih Chiou, Shin-Puu Jeng | 2021-02-02 |
| 10879194 | Semiconductor device package and method of manufacturing the same | Li-Hui Cheng, Po-Hao Tsai, Jeh-Yin Chang, Li-Chung Kuo, Hsien-Ju Tsou +3 more | 2020-12-29 |
| 10872850 | Package structure and method of forming thereof | Li-Hui Cheng, Po-Hao Tsai | 2020-12-22 |
| 10867897 | PoP device | Chin-Chuan Chang, Nai-Wei Liu, Wan-Ting Shih | 2020-12-15 |
| 10867965 | Package structures and methods of forming the same | Ying-Ching Shih, Chi-Hsi Wu, Chen-Hua Yu, Chih-Wei Wu, Pu Wang +1 more | 2020-12-15 |
| 10861835 | Solution for reducing poor contact in InFO package | Chen-Hua Yu, Szu-Wei Lu, Shih-Ting Lin, Shin-Puu Jeng | 2020-12-08 |
| 10847414 | Embedded 3D interposer structure | Ying-Ching Shih, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu | 2020-11-24 |
| 10847443 | Front-to-back bonding with through-substrate via (TSV) | — | 2020-11-24 |