Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7932601 | Enhanced copper posts for wafer level chip scale packaging | Han-Ping Pu, Pei-Haw Tsao | 2011-04-26 |
| 7820543 | Enhanced copper posts for wafer level chip scale packaging | Han-Ping Pu, Pei-Haw Tsao | 2010-10-26 |
| 7804177 | Silicon-based thin substrate and packaging schemes | Szu-Wei Lu, Clinton Chao, Ann Luh, Tjandra Winata Karta, Jerry Tzou | 2010-09-28 |
| 7662665 | Method for fabricating a semiconductor package including stress relieving layer for flip chip packaging | Chen-Shien Chen, Szu-Wei Lu, Pei-Haw Tsao, Chung Yu Wang, Han-Liang Tseng +1 more | 2010-02-16 |
| 7271480 | Constraint stiffener design | Ching-Yu Ni | 2007-09-18 |