Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417973 | Semiconductor packaging structure and method for manufacturing the same | Chen-Te Chu, Yuan-Yang Hsiao, Chih-Pin Chiu, Ying-Yao Lai, Chen-Chiu Huang +1 more | 2025-09-16 |
| 12406952 | Chip structure with conductive layer | Chih-Fan Huang, Hui-Chi Chen, Dian-Hau Chen, Yen-Ming Chen | 2025-09-02 |
| 12368094 | Semiconductor structures and methods of forming the same | Yuan-Yang Hsiao, Chen-Chiu Huang, Dian-Hau Chen | 2025-07-22 |
| 12186847 | Selective field-assisted machining system | Jianfeng Xu, Zhengding Zheng, Jianguo Zhang, Kai-Feng Huang, Xiao Ling Chen +1 more | 2025-01-07 |
| 12057419 | Method for forming chip structure with conductive structure | Chih-Fan Huang, Hui-Chi Chen, Dian-Hau Chen, Yen-Ming Chen | 2024-08-06 |
| 11437331 | Chip structure and method for forming the same | Chih-Fan Huang, Hui-Chi Chen, Dian-Hau Chen, Yen-Ming Chen | 2022-09-06 |
| 11222857 | Method of forming a photoresist over a bond pad to mitigate bond pad corrosion | Chih-Fan Huang, Dian-Hau Chen, Tzu-Li Lee, Yen-Ming Chen, Tzung-Luen Li | 2022-01-11 |
| 11189538 | Semiconductor structure with polyimide packaging and manufacturing method | Chih-Fan Huang, Kuo-Chin Chang, Hui-Chi Chen, Dian-Hau Chen, Yen-Ming Chen | 2021-11-30 |
| 9893191 | FinFET transistor with u-shaped channel | Tsung-Yao Wen, Sai-Hooi Yeong | 2018-02-13 |