Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417973 | Semiconductor packaging structure and method for manufacturing the same | Chen-Te Chu, Yuan-Yang Hsiao, Chih-Pin Chiu, Mao-Nan Wang, Chen-Chiu Huang +1 more | 2025-09-16 |
| 12300640 | Semiconductor device and method of manufacturing thereof | Tsung-Chieh Hsiao, Hsiang-Ku Shen, Yuan-Yang Hsiao, Dian-Hau Chen | 2025-05-13 |
| 12080753 | Device structure with a redistribution layer and a buffer layer | Tsung-Chieh Hsiao, Hsiang-Ku Shen, Yuan-Yang Hsiao, Dian-Hau Chen | 2024-09-03 |
| 11961880 | Metal-insulator-metal structure | Yuan-Yang Hsiao, Hsiang-Ku Shen, Tsung-Chieh Hsiao, Dian-Hau Chen | 2024-04-16 |
| 11728295 | Semiconductor device and method of manufacturing thereof | Tsung-Chieh Hsiao, Hsiang-Ku Shen, Yuan-Yang Hsiao, Dian-Hau Chen | 2023-08-15 |
| 11715756 | Device structure and methods of forming the same | Tsung-Chieh Hsiao, Hsiang-Ku Shen, Yuan-Yang Hsiao, Dian-Hau Chen | 2023-08-01 |