Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955441 | Interconnect structure and forming method thereof | Jian-Hong Lin, Kuo-Yen Liu, Hsin Chang, Yu-Ching Lee, Yih Wang | 2024-04-09 |
| 11855192 | Semiconductor device and manufacturing method thereof | Han-Yu Lin, Fang-Wei Lee, Kai Tak Lam, Raghunath PUTIKAM, Tzer-Min Shen +4 more | 2023-12-26 |
| 11302654 | Method of fabricating semiconductor device including dummy via anchored to dummy metal layer | Jian-Hong Lin, Kuo-Yen Liu, Hsin Chang, Yu-Ching Lee, Yih Wang | 2022-04-12 |
| 11222857 | Method of forming a photoresist over a bond pad to mitigate bond pad corrosion | Chih-Fan Huang, Dian-Hau Chen, Mao-Nan Wang, Yen-Ming Chen, Tzung-Luen Li | 2022-01-11 |
| 10777510 | Semiconductor device including dummy via anchored to dummy metal layer | Jian-Hong Lin, Kuo-Yen Liu, Hsin Chang, Yu-Ching Lee, Yih Wang | 2020-09-15 |
| 8988652 | Method and apparatus for ultraviolet (UV) patterning with reduced outgassing | Shu-Hao Chang, Tsiao-Chen Wu, Chia-Hao Hsu, Chia-Chen Chen, Ying-Yu Chen +3 more | 2015-03-24 |
| 8848374 | Method and structure for dissipating heat away from a resistor having neighboring devices and interconnects | Jian-Hong Lin, Chin Chuan Peng, Bi-Ling Lin, Bor-Jou Wei, Chien Shih Tsai | 2014-09-30 |
| 8541264 | Method for forming semiconductor structure having protection layer for preventing laser damage | Jian-Hong Lin, Kang-Cheng Lin | 2013-09-24 |
| 8354346 | Method for fabricating low-k dielectric and Cu interconnect | Chih-Hao Chen, Chia-Cheng Chou, Ming-Chung Liang, Keng-Chu Lin | 2013-01-15 |
| 8242576 | Protection layer for preventing laser damage on semiconductor devices | Jian-Hong Lin, Kang-Cheng Lin | 2012-08-14 |
| 8212330 | Process for improving the reliability of interconnect structures and resulting structure | Hsien-Wei Chen, Jian-Hong Lin | 2012-07-03 |
| 7998873 | Method for fabricating low-k dielectric and Cu interconnect | Chih-Hao Chen, Chia-Cheng Chou, Ming-Chung Liang, Keng-Chu Lin | 2011-08-16 |
| 7816256 | Process for improving the reliability of interconnect structures and resulting structure | Hsien-Wei Chen, Jian-Hong Lin | 2010-10-19 |