Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955441 | Interconnect structure and forming method thereof | Jian-Hong Lin, Hsin Chang, Tzu-Li Lee, Yu-Ching Lee, Yih Wang | 2024-04-09 |
| 11302654 | Method of fabricating semiconductor device including dummy via anchored to dummy metal layer | Jian-Hong Lin, Hsin Chang, Tzu-Li Lee, Yu-Ching Lee, Yih Wang | 2022-04-12 |
| 11177211 | Method of manufacturing via structures of semiconductor devices | Boo Yeh, Min-Chang Liang, Jui-Yao Lai, Sai-Hooi Yeong, Ying-Yan Chen +1 more | 2021-11-16 |
| 10777510 | Semiconductor device including dummy via anchored to dummy metal layer | Jian-Hong Lin, Hsin Chang, Tzu-Li Lee, Yu-Ching Lee, Yih Wang | 2020-09-15 |
| 10629527 | Method of manufacturing semiconductor device with multi wire structure | Boo Yeh, Min-Chang Liang, Jui-Yao Lai, Sai-Hooi Yeong, Ying-Yan Chen +1 more | 2020-04-21 |
| 10269697 | Semiconductor device and manufacturing method thereof | Boo Yeh, Min-Chang Liang, Jui-Yao Lai, Sai-Hooi Yeong, Ying-Yan Chen +1 more | 2019-04-23 |
| 6835649 | Tungsten plug with conductor capping layer | Wei-Cheng Lee, Wen-Chen Chien, Yu-Da Fan, Yu-Ching Chang | 2004-12-28 |