Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7015129 | Bond pad scheme for Cu process | Chia-Hung Lai, Tzong-Sheng Chang, Min Cao, Huan Chi Tseng, Yu-Hua Lee +1 more | 2006-03-21 |
| 6844626 | Bond pad scheme for Cu process | Chia-Hung Lai, Tzong-Sheng Chang, Min Cao, Huan Chi Tseng, Yu-Hua Lee +1 more | 2005-01-18 |
| 5629237 | Taper etching without re-entrance profile | Pei-Jan Wang, Kuei-Lung Chou, Hsien-Wen Chang | 1997-05-13 |
| 5461254 | Method and resulting device for field inversion free multiple layer metallurgy VLSI processing | Lih-Shyng Tsai, Kwang-Ming Lin, Shu-Lan Ying | 1995-10-24 |
| 5334554 | Nitrogen plasma treatment to prevent field device leakage in VLSI processing | Kwang-Ming Lin, Lih-Shyig Tsai, Yung-Haw Liaw | 1994-08-02 |
| 5286667 | Modified and robust self-aligning contact process | Lih-Shyng Tsai, Hsien-Wen Chang, Chang-Tai Chiao | 1994-02-15 |
| 5252515 | Method for field inversion free multiple layer metallurgy VLSI processing | Lih-Shyng Tsai, Kwang-Ming Lin, Shu-Lan Ying | 1993-10-12 |
| 5248384 | Rapid thermal treatment to eliminate metal void formation in VLSI manufacturing process | Kwang-Ming Lin, Lih-Shyng Tsai, Chin-Twan Wei | 1993-09-28 |