Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9892982 | Method for controlling exhaust flow in wafer processing module | Kuo-Shu Tseng, Chien-Hua Chen, You-Feng CHEN, Yen-Yu Chen, Zhong Chen | 2018-02-13 |
| 6365303 | Electrostatic discharge damage prevention method on masks | Chang-Cheng Hung, Jeen-Hao Liu, Yi-Hsu Chen, Dong-Hsu Cheng, Deng-Guey Juang | 2002-04-02 |
| 6247599 | Electrostatic discharge-free container equipped with metal shield | Dong-Hsu Cheng, Deng-Guey Juang | 2001-06-19 |
| 6143618 | Procedure for elimating flourine degradation of WSi.sub.x /oxide/polysilicon capacitors | Hsin Chen, Ching-Tang Tsai, Tien-Chen Chang | 2000-11-07 |
| 6127269 | Method for enhancing sheet resistance uniformity of chemical vapor deposited (CVD) tungsten silicide layers | May-Ling Chu | 2000-10-03 |
| 5731243 | Method of cleaning residue on a semiconductor wafer bonding pad | Tzu-Min Peng, Cheng-Te Chu, Hsin-Chieh Huang | 1998-03-24 |
| 5454871 | SOG coated apparatus to solve SOG non-uniformity in the VLSI process | Hsin-Chieh Huang, Pao-Ling Kuo | 1995-10-03 |
| 5434096 | Method to prevent silicide bubble in the VLSI process | Cheng-Te Chu, Tien-Chang Chang, Hsin-Chieh Huang | 1995-07-18 |
| 5371046 | Method to solve sog non-uniformity in the VLSI process | Hsin-Chieh Huang, Pao-Ling Kuo | 1994-12-06 |
| 5334554 | Nitrogen plasma treatment to prevent field device leakage in VLSI processing | Kwang-Ming Lin, Lih-Shyig Tsai, Jiunn-Jyi Lin | 1994-08-02 |