Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5731243 | Method of cleaning residue on a semiconductor wafer bonding pad | Tzu-Min Peng, Yung-Haw Liaw, Hsin-Chieh Huang | 1998-03-24 |
| 5434096 | Method to prevent silicide bubble in the VLSI process | Yung-Haw Liaw, Tien-Chang Chang, Hsin-Chieh Huang | 1995-07-18 |