CW

Chin-Twan Wei

TSMC: 1 patents #8,466 of 12,232Top 70%
📍 Baoshan, TW: #2,187 of 3,661 inventorsTop 60%
Overall (All Time): #3,834,087 of 4,157,543Top 95%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5248384 Rapid thermal treatment to eliminate metal void formation in VLSI manufacturing process Kwang-Ming Lin, Lih-Shyng Tsai, Jiunn-Jyi Lin 1993-09-28