Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5461254 | Method and resulting device for field inversion free multiple layer metallurgy VLSI processing | Jiunn-Jyi Lin, Kwang-Ming Lin, Shu-Lan Ying | 1995-10-24 |
| 5286667 | Modified and robust self-aligning contact process | Jiunn-Jyi Lin, Hsien-Wen Chang, Chang-Tai Chiao | 1994-02-15 |
| 5252515 | Method for field inversion free multiple layer metallurgy VLSI processing | Jiunn-Jyi Lin, Kwang-Ming Lin, Shu-Lan Ying | 1993-10-12 |
| 5248384 | Rapid thermal treatment to eliminate metal void formation in VLSI manufacturing process | Kwang-Ming Lin, Jiunn-Jyi Lin, Chin-Twan Wei | 1993-09-28 |