Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476293 | Manufacturing method of chip package | Yen-Shih Ho, Tsang-Yu Liu | 2022-10-18 |
| 11387201 | Chip package and manufacturing method thereof | Chia-Ming Cheng, Jiun-Yen LAI, Ming-Chung Chung, Wei-Luen SUEN | 2022-07-12 |
| 11355659 | Chip package and manufacturing method thereof | Chia-Ming Cheng, Wei-Ming CHIEN | 2022-06-07 |
| 11340679 | Uninterruptible power system testing method | Chung-Hsing Chang, Heng-Yi Cheng, Chien-Yueh Tung, Kun-Fu Lee, Chung-Chih Tseng | 2022-05-24 |
| 11310904 | Chip package and power module | Tsang-Yu Liu, Wei-Ming CHIEN | 2022-04-19 |
| 11038077 | Chip package and manufacturing method thereof | Yen-Shih Ho, Chien-Min Lin, Yi-Rong Ho | 2021-06-15 |
| 10879530 | Anode material of nano-silicon having multilayer-graphene as carrier and coated with silicon suboxide and with amorphous carbon layer and method for fabricating the same | Biing-Jyh Weng, Chuen-Ming Gee, Bo-Wen Chen | 2020-12-29 |
| 10446504 | Chip package and method for forming the same | Chia-Ming Cheng, Wei-Chung Yang, Kuan-Jung Wu, Shu-Ming Chang | 2019-10-15 |
| 10424540 | Chip package and method for forming the same | Yen-Shih Ho, Chia-Ming Cheng, Hsin-Yen Lin | 2019-09-24 |
| 10153237 | Chip package and method for forming the same | Yen-Shih Ho, Chia-Sheng Lin, Wei-Luen SUEN | 2018-12-11 |
| 10096635 | Semiconductor structure and manufacturing method thereof | Wei-Ming CHIEN, Tsang-Yu Liu, Yen-Shih Ho | 2018-10-09 |
| 9947716 | Chip package and manufacturing method thereof | Yen-Shih Ho, Hsiao-Lan Yeh, Chia-Sheng Lin, Yi-Ming Chang, Hui-Hsien Wu +4 more | 2018-04-17 |
| 9875912 | Chip package and manufacturing method thereof | Yen-Shih Ho, Hsiao-Lan Yeh, Chia-Sheng Lin, Yi-Ming Chang, Hui-Hsien Wu +1 more | 2018-01-23 |
| 9780251 | Semiconductor structure and manufacturing method thereof | Wei-Luen SUEN, Wei-Ming CHIEN, Tsang-Yu Liu, Yen-Shih Ho | 2017-10-03 |
| 9640683 | Electrical contact structure with a redistribution layer connected to a stud | Wei-Luen SUEN, Wei-Ming CHIEN, Tsang-Yu Liu, Yen-Shih Ho | 2017-05-02 |
| 9613919 | Chip package and method for forming the same | Tsang-Yu Liu, Wei-Ming CHIEN | 2017-04-04 |
| 9406818 | Chip package and method of manufacturing the same | Tsang-Yu Liu, Shu-Ming Chang | 2016-08-02 |
| 9305842 | Fabrication methods of chip device packages | Chia-Sheng Lin | 2016-04-05 |
| 9269837 | Chip package and method of manufacturing the same | Tsang-Yu Liu, Shu-Ming Chang | 2016-02-23 |
| 9214579 | Electrical contact structure with a redistribution layer connected to a stud | Wei-Ming CHIEN, Tsang-Yu Liu, Yen-Shih Ho | 2015-12-15 |
| 9196571 | Chip device packages and fabrication methods thereof | Chia-Sheng Lin | 2015-11-24 |
| 8952519 | Chip package and fabrication method thereof | Chia-Sheng Lin | 2015-02-10 |
| 8872196 | Chip package | Chien-Hung Liu | 2014-10-28 |
| 8823179 | Electronic device package and method for fabricating the same | Chia-Lun Tsai, Wen-Cheng Chien, Wei-Ming Chen, Chien-Hung Liu, Ying-Nan Wen | 2014-09-02 |
| 8432032 | Chip package and fabrication method thereof | Chia-Sheng Lin, Chia-Lun Tsai, Chang-Sheng Hsu | 2013-04-30 |