Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446504 | Chip package and method for forming the same | Chia-Ming Cheng, Po-Han Lee, Wei-Chung Yang, Shu-Ming Chang | 2019-10-15 |
| 9548265 | Chip package and manufacturing method thereof | Yen-Shih Ho, Shu-Ming Chang, Hsing-Lung SHEN, Yu-Hao SU, Yi-Hua Cheng | 2017-01-17 |