Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8710680 | Electronic device package and fabrication method thereof | Shu-Ming Chang, Bai-Yao Lou, Chien-Hung Liu | 2014-04-29 |
| 8692284 | Interposer and manufacturing method thereof | Chien-Hung Liu, Wei-Chung Yang | 2014-04-08 |
| 8643070 | Chip package and method for forming the same | Shu-Ming Chang, Chien-Hui Chen, Yen-Shih Ho, Chien-Hung Liu, Ho-Yin Yiu | 2014-02-04 |
| 8614488 | Chip package and method for forming the same | Ho-Yin Yiu, Yen-Shih Ho, Shu-Ming Chang, Chien-Hung Liu, Shih-Yi LEE +1 more | 2013-12-24 |
| 8610271 | Chip package and manufacturing method thereof | Baw-Ching Perng, Shu-Ming Chang | 2013-12-17 |
| 8564133 | Chip package and method for forming the same | Baw-Ching Perng, Wei-Ming Chen, Shu-Ming Chang | 2013-10-22 |
| 8410599 | Power MOSFET package | Baw-Ching Perng, Shu-Ming Chang, Ching-Yu Ni, Yun-Jui Hsieh, Wei-Ming Chen +2 more | 2013-04-02 |
| 6365498 | Integrated process for I/O redistribution and passive components fabrication and devices formed | Tsung-Yao Chu, Szu-Wei Lu | 2002-04-02 |
| 6268114 | Method for forming fine-pitched solder bumps | Ling-Chen Kung, Szu-Wei Lu, Ruoh-Huey Uang | 2001-07-31 |