Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9136241 | Chip package and manufacturing method thereof | Yu-Lin Yen, Yu-Lung Huang, Tsang-Yu Liu, Yen-Shih Ho | 2015-09-15 |
| 8993365 | Wafer packaging method | Yi-Ming Chang, Yi-Cheng Wang, Sheng-Yen Chang | 2015-03-31 |
| 8748926 | Chip package with multiple spacers and method for forming the same | Yi-Ming Chang, Hsi-Chien Lin | 2014-06-10 |