Issued Patents All Time
Showing 26–50 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9640683 | Electrical contact structure with a redistribution layer connected to a stud | Wei-Luen SUEN, Wei-Ming CHIEN, Po-Han Lee, Tsang-Yu Liu | 2017-05-02 |
| 9640488 | Chip package and method for forming the same | Yi-Min Lin, Yi-Ming Chang, Shu-Ming Chang, Tsang-Yu Liu, Chia-Ming Cheng | 2017-05-02 |
| 9633935 | Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same | Chih-Wei Ho, Tsang-Yu Liu | 2017-04-25 |
| 9613904 | Semiconductor structure and manufacturing method thereof | Yu-Tung Chen, Chien-Min Lin, Chuan-Jin Shiu, Chih-Wei Ho | 2017-04-04 |
| 9611143 | Method for forming chip package | Tsang-Yu Liu, Chia-Sheng Lin, Yi-Ming Chang | 2017-04-04 |
| 9601460 | Chip package including recess in side edge | Tsang-Yu Liu, Chia-Sheng Lin, Chia-Ming Cheng, Shu-Ming Chang, Tzu-Wen Tseng | 2017-03-21 |
| 9570398 | Chip package and method for forming the same | Shu-Ming Chang, Yu-Ting Huang, Tsang-Yu Liu | 2017-02-14 |
| 9548265 | Chip package and manufacturing method thereof | Shu-Ming Chang, Hsing-Lung SHEN, Yu-Hao SU, Kuan-Jung Wu, Yi-Hua Cheng | 2017-01-17 |
| 9450015 | Manufacturing method of semiconductor structure | Wei-Ming CHIEN, Chia-Sheng Lin, Tsang-Yu Liu | 2016-09-20 |
| 9437478 | Chip package and method for forming the same | Tsang-Yu Liu, Shu-Ming Chang, Yu-Lung Huang, Chao-Yen Lin, Wei-Luen SUEN +2 more | 2016-09-06 |
| 9425134 | Chip package | Tsang-Yu Liu, Shu-Ming Chang, Yu-Lung Huang, Chao-Yen Lin, Wei-Luen SUEN +1 more | 2016-08-23 |
| 9419050 | Manufacturing method of semiconductor structure with protein tape | Shu-Ming Chang, Yung-Tai Tsai, Tsang-Yu Liu | 2016-08-16 |
| 9406590 | Chip package and manufacturing method thereof | Chia-Sheng Lin, Tsang-Yu Liu | 2016-08-02 |
| 9373597 | Chip package and method thereof | Chia-Ming Cheng, Shu-Ming Chang | 2016-06-21 |
| 9355975 | Chip package and method for forming the same | Tsang-Yu Liu, Shu-Ming Chang, Yu-Lung Huang, Chao-Yen Lin, Wei-Luen SUEN +2 more | 2016-05-31 |
| 9334156 | Chip package and method thereof | Chien-Min Lin, Yu-Ting Huang, Chen-Ning Fu | 2016-05-10 |
| 9334158 | Chip package and method for forming the same | Yu-Ting Huang, Shu-Ming Chang, Tsang-Yu Liu | 2016-05-10 |
| 9331024 | IC wafer having electromagnetic shielding effects and method for making the same | Yao-Hsiang Chen, Tsang-Yu Liu, Shu-Ming Chang | 2016-05-03 |
| 9331256 | Semiconductor structure with sensor chip and landing pads | Wei-Ming CHIEN, Chia-Sheng Lin, Tsang-Yu Liu | 2016-05-03 |
| 9305843 | Chip package and method for forming the same | Bing-Siang Chen, Chien-Hui Chen, Shu-Ming Chang, Tsang-Yu Liu | 2016-04-05 |
| 9287417 | Semiconductor chip package and method for manufacturing thereof | Wei-Luen SUEN, Shu-Ming Chang, Yu-Lung Huang, Tsang-Yu Liu | 2016-03-15 |
| 9275963 | Semiconductor structure having stage difference surface and manufacturing method thereof | Yung-Tai Tsai, Shu-Ming Chang, Chun-Wei Chang, Chien-Hui Chen, Tsang-Yu Liu | 2016-03-01 |
| 9275958 | Chip package and method for forming the same | Yi-Min Lin, Yi-Ming Chang, Shu-Ming Chang, Tsang-Yu Liu, Chia-Ming Cheng | 2016-03-01 |
| 9236320 | Chip package | Yi-Ming Chang, Tsang-Yu Liu, Ying-Nan Wen | 2016-01-12 |
| 9214579 | Electrical contact structure with a redistribution layer connected to a stud | Wei-Ming CHIEN, Po-Han Lee, Tsang-Yu Liu | 2015-12-15 |