Issued Patents All Time
Showing 76–85 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7294544 | Method of making a metal-insulator-metal capacitor in the CMOS process | Jau-Yuann Chung, Chun-Hon Chen, Hun-Jan Tao | 2007-11-13 |
| 7038294 | Planar spiral inductor structure with patterned microelectronic structure integral thereto | Ssu-Pin Ma | 2006-05-02 |
| 6881996 | Metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer | Chun-Hon Chen, Ssu-Pin Ma, Ta-Hsun Yeh, Kuo-Reay Peng, Heng-Ming Hsu +2 more | 2005-04-19 |
| 6812088 | Method for making a new metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer | Chun-Hon Chen, Ssu-Pin Ma, Ta-Hsun Yeh, Kuo-Reay Peng, Heng-Ming Hsu +2 more | 2004-11-02 |
| 6667217 | Method of fabricating a damascene copper inductor structure using a sub-0.18 um CMOS process | Heng-Ming Hsu, Jau-Yuann Chung, Chun-Hon Chen, Kuo-Reay Peng, Ta-Hsun Yeh +2 more | 2003-12-23 |
| 6472721 | Dual damascene interconnect structures that include radio frequency capacitors and inductors | Ssu-Pin Ma, Chun-Hon Chen, Ta-Hsun Yeh, Kuo-Reay Peng, Heng-Ming Hsu +2 more | 2002-10-29 |
| 6329234 | Copper process compatible CMOS metal-insulator-metal capacitor structure and its process flow | Ssu-Pin Ma, Chun-Hon Chen, Ta-Hsun Yeh, Kuo-Reay Peng, Heng-Ming Hsu +2 more | 2001-12-11 |
| 6096629 | Uniform sidewall profile etch method for forming low contact leakage schottky diode contact | Jun-Lin Tsai | 2000-08-01 |
| 6051475 | Method for manufacturing a silicide to silicide capacitor | Chun-Hon Chen | 2000-04-18 |
| 6004829 | Method of increasing end point detection capability of reactive ion etching by adding pad area | Tzong-Sheng Chang, Ruey-Hsin Liou, Yuan Yu | 1999-12-21 |