Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8785956 | Chip package having optical-electronic device with plurality of light shielding layers and substrate through-hole with void, and method for forming the same | Chuan-Jin Shiu, Po-Shen Lin, Yi-Ming Chang, Hui-Ching Yang | 2014-07-22 |