Issued Patents All Time
Showing 51–75 of 105 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9334158 | Chip package and method for forming the same | Yu-Ting Huang, Shu-Ming Chang, Yen-Shih Ho | 2016-05-10 |
| 9331024 | IC wafer having electromagnetic shielding effects and method for making the same | Yao-Hsiang Chen, Yen-Shih Ho, Shu-Ming Chang | 2016-05-03 |
| 9331256 | Semiconductor structure with sensor chip and landing pads | Wei-Ming CHIEN, Chia-Sheng Lin, Yen-Shih Ho | 2016-05-03 |
| 9318461 | Wafer level array of chips and method thereof | Chun-Wei Chang, Kuei-Wei Chen, Chia-Ming Cheng, Chia-Sheng Lin, Chien-Hui Chen | 2016-04-19 |
| 9305843 | Chip package and method for forming the same | Bing-Siang Chen, Chien-Hui Chen, Shu-Ming Chang, Yen-Shih Ho | 2016-04-05 |
| 9293394 | Chip package and method for forming the same | Bai-Yao Lou, Chia-Sheng Lin, Tzu-Hsiang Hung | 2016-03-22 |
| 9287417 | Semiconductor chip package and method for manufacturing thereof | Wei-Luen SUEN, Shu-Ming Chang, Yu-Lung Huang, Yen-Shih Ho | 2016-03-15 |
| 9275958 | Chip package and method for forming the same | Yi-Min Lin, Yi-Ming Chang, Shu-Ming Chang, Yen-Shih Ho, Chia-Ming Cheng | 2016-03-01 |
| 9275963 | Semiconductor structure having stage difference surface and manufacturing method thereof | Yung-Tai Tsai, Shu-Ming Chang, Chun-Wei Chang, Chien-Hui Chen, Yen-Shih Ho | 2016-03-01 |
| 9269837 | Chip package and method of manufacturing the same | Shu-Ming Chang, Po-Han Lee | 2016-02-23 |
| 9236320 | Chip package | Yi-Ming Chang, Yen-Shih Ho, Ying-Nan Wen | 2016-01-12 |
| 9230927 | Method of fabricating wafer-level chip package | Chuan-Jin Shiu, Chih-Wei Ho, Shih-Hsing Chan, Ching-Jui Chuang | 2016-01-05 |
| 9214579 | Electrical contact structure with a redistribution layer connected to a stud | Wei-Ming CHIEN, Po-Han Lee, Yen-Shih Ho | 2015-12-15 |
| 9184092 | Chip package and method for forming the same | Yu-Lin Yen, Chien-Hui Chen, Long-Sheng Yeou | 2015-11-10 |
| 9177905 | Chip package having sensing element and method for forming the same | Yu-Ting Huang | 2015-11-03 |
| 9177862 | Semiconductor stack structure and fabrication method thereof | Yen-Shih Ho, Hsin Kuan, Long-Sheng Yeou, Chia-Ming Cheng | 2015-11-03 |
| 9153707 | Chip package and method for forming the same | Yen-Shih Ho, Ying-Nan Wen | 2015-10-06 |
| 9153528 | Chip package and method for forming the same | Po-Shen Lin, Yen-Shih Ho, Chih-Wei Ho, Yu-Min Liang | 2015-10-06 |
| 9142486 | Chip package and fabrication method thereof | Yi-Ming Chang, Tzu-Min Chen | 2015-09-22 |
| 9136241 | Chip package and manufacturing method thereof | Yu-Lin Yen, Kuo-Hua Liu, Yu-Lung Huang, Yen-Shih Ho | 2015-09-15 |
| 9054114 | Chip package structure and manufacturing method thereof | Hung-Jen Lee, Shu-Ming Chang, Chen-Han Chiang, Yen-Shih Ho | 2015-06-09 |
| 9024437 | Chip package and method for forming the same | Yu-Lin Yen, Chien-Hui Chen, Yen-Shih Ho | 2015-05-05 |
| 9018770 | Chip package | Chia-Ming Cheng | 2015-04-28 |
| 9006896 | Chip package and method for forming the same | Yu-Lung Huang, Shu-Ming Chang | 2015-04-14 |
| 8981497 | Chip package structure and method for forming the same | Ho-Yin Yiu, Chien-Hung Liu, Ying-Nan Wen, Yen-Shih Ho | 2015-03-17 |