Issued Patents All Time
Showing 76–100 of 105 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8975755 | Chip package | Yen-Shih Ho, Chia-Sheng Lin | 2015-03-10 |
| 8963312 | Stacked chip package and method for forming the same | Yen-Shih Ho, Shu-Ming Chang, Yu-Lung Huang, Chao-Yen Lin, Wei-Luen SUEN +1 more | 2015-02-24 |
| 8951836 | Chip package and method for forming the same | Yu-Lin Yen, Chien-Hui Chen, Long-Sheng Yeou | 2015-02-10 |
| 8928098 | Semiconductor package and fabrication method thereof | Hung-Jen Lee, Shu-Ming Chang, Yen-Shih Ho | 2015-01-06 |
| 8900924 | Chip package and method for forming the same | Shu-Ming Chang, Yen-Shih Ho | 2014-12-02 |
| 8890268 | Chip package and fabrication method thereof | Yu-Lung Huang | 2014-11-18 |
| 8803326 | Chip package | Chia-Ming Cheng | 2014-08-12 |
| 8779557 | Chip package and package wafer with a recognition mark, and method for forming the same | Chia-Sheng Lin, Chia-Ming Cheng, Po-Shen Lin | 2014-07-15 |
| 8779558 | Chip package structure and manufacturing method thereof | Hung-Jen Lee, Shu-Ming Chang, Chen-Han Chiang, Yen-Shih Ho | 2014-07-15 |
| 8741683 | Chip package and fabrication method thereof | Yu-Lung Huang | 2014-06-03 |
| 8742564 | Chip package and method for forming the same | Bai-Yao Lou, Chia-Sheng Lin, Tzu-Hsiang Hung | 2014-06-03 |
| 8698316 | Chip package | Yu-Lin Yen, Chien-Hui Chen, Long-Sheng Yeou | 2014-04-15 |
| 8692300 | Interposer and method for forming the same | Ming-Kun Yang, Yen-Shih Ho | 2014-04-08 |
| 8692382 | Chip package | Yu-Lin Yen, Chien-Hui Chen, Long-Sheng Yeou | 2014-04-08 |
| 8674518 | Chip package and method for forming the same | Shu-Ming Chang, Yen-Shih Ho | 2014-03-18 |
| 8673686 | Chip package structure and manufacturing method thereof | Hung-Jen Lee, Shu-Ming Chang, Chen-Han Chiang, Yen-Shih Ho | 2014-03-18 |
| 8633558 | Package structure for a chip and method for fabricating the same | Ta-Hsuan Lin, Chuan-Jin Shiu, Chia-Ming Cheng | 2014-01-21 |
| 8633091 | Chip package and fabrication method thereof | Chia-Lun Tsai, Chia-Ming Cheng | 2014-01-21 |
| 8624362 | IC wafer having electromagnetic shielding effects and method for making the same | Yao-Hsiang Chen, Yen-Shih Ho, Shu-Ming Chang | 2014-01-07 |
| 8581386 | Chip package | Yu-Lin Yen, Shih-Ming Chen, Hsi-Chien Lin, Yu-Lung Huang | 2013-11-12 |
| 8575634 | Chip package and method for fabricating the same | Yu-Lin Yen, Chuan-Jin Shiu, Po-Shen Lin | 2013-11-05 |
| 8552565 | Chip package and method for forming the same | Yu-Lin Yen, Chien-Hui Chen, Long-Sheng Yeou | 2013-10-08 |
| 8536671 | Chip package | Yu-Lin Yen, Chuan-Jin Shiu, Po-Shen Lin | 2013-09-17 |
| 8525345 | Chip package and method for forming the same | Yu-Lin Yen, Chien-Hui Chen, Long-Sheng Yeou | 2013-09-03 |
| 8409925 | Chip package structure and manufacturing method thereof | Hung-Jen Lee, Shu-Ming Chang, Chen-Han Chiang, Yen-Shih Ho | 2013-04-02 |