Issued Patents All Time
Showing 101–105 of 105 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8399963 | Chip package and fabrication method thereof | Chia-Lun Tsai, Chia-Ming Cheng | 2013-03-19 |
| 8207615 | Chip package and method for fabricating the same | Bai-Yao Lou, Long-Sheng Yeou | 2012-06-26 |
| 8174044 | Light emitting diode package and method for forming the same | Shang-Yi Wu | 2012-05-08 |
| 8021992 | High aspect ratio gap fill application using high density plasma chemical vapor deposition | Joung-Wei Liou, Chien-Feng Lin, Cheng-Liang Chang, Ming-Te Chen, Chia-Hui Lin +3 more | 2011-09-20 |
| 6897147 | Solution for copper hillock induced by thermal strain with buffer zone for strain relaxation | Shin-Yeu Tsai, Po-Hsiung Leu, Chia-Ming Yang, Yun-Da Fan, Chen-Peng Fan | 2005-05-24 |