JW

Juan-Yi Wu

Microsoft: 2 patents #17,506 of 40,388Top 45%
Overall (All Time): #1,728,725 of 4,157,543Top 45%
2
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12376226 Printed circuit board mesh routing to reduce solder ball joint failure during reflow Benito Joseph Rodriguez, Shu-Ming Chang, Dillip K. Dash, Po-Chun Yang 2025-07-29
11212912 Printed circuit board mesh routing to reduce solder ball joint failure during reflow Benito Joseph Rodriguez, Shu-Ming Chang, Dillip K. Dash, Po-Chun Yang 2021-12-28