Issued Patents All Time
Showing 51–75 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8766431 | Power MOSFET package | Baw-Ching Perng, Ying-Nan Wen, Ching-Yu Ni, Yun-Ji Hsieh, Wei-Ming Chen +2 more | 2014-07-01 |
| 8728871 | Method for fabricating electronic device package | Wei-Ming Chen | 2014-05-20 |
| 8710680 | Electronic device package and fabrication method thereof | Bai-Yao Lou, Ying-Nan Wen, Chien-Hung Liu | 2014-04-29 |
| 8674518 | Chip package and method for forming the same | Tsang-Yu Liu, Yen-Shih Ho | 2014-03-18 |
| 8673686 | Chip package structure and manufacturing method thereof | Hung-Jen Lee, Chen-Han Chiang, Tsang-Yu Liu, Yen-Shih Ho | 2014-03-18 |
| 8643070 | Chip package and method for forming the same | Chien-Hui Chen, Yen-Shih Ho, Chien-Hung Liu, Ho-Yin Yiu, Ying-Nan Wen | 2014-02-04 |
| 8643198 | Electronic device package and method for forming the same | Wen-Cheng Chien, Ching-Yu Ni | 2014-02-04 |
| 8633582 | Chip package and fabrication method thereof | Cheng-Te Chou | 2014-01-21 |
| 8624362 | IC wafer having electromagnetic shielding effects and method for making the same | Yao-Hsiang Chen, Tsang-Yu Liu, Yen-Shih Ho | 2014-01-07 |
| 8624351 | Package structure and method for making the same | Chien-Hung Liu | 2014-01-07 |
| 8614488 | Chip package and method for forming the same | Ying-Nan Wen, Ho-Yin Yiu, Yen-Shih Ho, Chien-Hung Liu, Shih-Yi LEE +1 more | 2013-12-24 |
| 8610271 | Chip package and manufacturing method thereof | Baw-Ching Perng, Ying-Nan Wen | 2013-12-17 |
| 8562561 | Safety syringe with retractable rotation | — | 2013-10-22 |
| 8564133 | Chip package and method for forming the same | Ying-Nan Wen, Baw-Ching Perng, Wei-Ming Chen | 2013-10-22 |
| 8552547 | Electronic device package and method for forming the same | Wen-Cheng Chien, Ching-Yu Ni | 2013-10-08 |
| 8541877 | Electronic device package and method for fabricating the same | Chia-Lun Tsai, Ching-Yu Ni, Tien-Hao Huang, Chia-Ming Cheng, Wen-Cheng Chien +3 more | 2013-09-24 |
| 8536672 | Image sensor package and fabrication method thereof | Tien-Hao Huang | 2013-09-17 |
| 8531009 | Package structure of three-dimensional stacking dice and method for manufacturing the same | Chun-Te Lin, Tzu-Ying Kuo | 2013-09-10 |
| 8410599 | Power MOSFET package | Baw-Ching Perng, Ying-Nan Wen, Ching-Yu Ni, Yun-Jui Hsieh, Wei-Ming Chen +2 more | 2013-04-02 |
| 8409925 | Chip package structure and manufacturing method thereof | Hung-Jen Lee, Chen-Han Chiang, Tsang-Yu Liu, Yen-Shih Ho | 2013-04-02 |
| 8367477 | Electronic device package and method for forming the same | Wen-Cheng Chien, Ching-Yu Ni | 2013-02-05 |
| 8310050 | Electronic device package and fabrication method thereof | Wei-Ming Chen | 2012-11-13 |
| 8227927 | Chip package and fabrication method thereof | Wei-Ming Chen | 2012-07-24 |
| 8193632 | Three-dimensional conducting structure and method of fabricating the same | Hsiang-Hung Chang, Tzu-Ying Kuo, Yuan-Chang Lee | 2012-06-05 |
| 8164587 | LCD power supply | Shwang-Shi Bai, Shen-Yao Liang | 2012-04-24 |