Issued Patents All Time
Showing 101–104 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7183494 | Bonding structure with buffer layer and method of forming the same | Su-Tsai Lu, Shyh-Ming Chang, Yao-Sheng Lin, Yuan-Chang Huang | 2007-02-27 |
| 7119429 | 3-D stackable semiconductor package | Tzong-Che Ho | 2006-10-10 |
| 6998718 | Wafer level chip scale packaging structure and method of fabricating the same | Lee-Cheng Shen | 2006-02-14 |
| 5417105 | Flow accelerator for leak detector probe | Erasmo Martinez, Steven E. Walmsley | 1995-05-23 |